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Reliability of ACF in Flip-Chip with Various Bump Height
- Wu, C M L (author)
-
- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
- Yeung, N H (author)
- (creator_code:org_t)
- 2000
- 2000
- English.
- In: Proceedings of the 4th Adhesive joining and Coating Technology in Electronics Manufacturing. ; , s. 101-106
- Conference paper (peer-reviewed)
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- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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- ref (subject category)
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- Wu, C M L
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