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A highly integrated chipset for 40 Gbps wireless D-band communication based on a 250 nm InP DHBT technology

Carpenter, Sona, 1983 (author)
Chalmers tekniska högskola,Chalmers University of Technology
He, Zhongxia Simon, 1984 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Bao, M. (author)
Telefonaktiebolaget L M Ericsson,Ericsson
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Zirath, Herbert, 1955 (author)
Chalmers tekniska högskola,Chalmers University of Technology
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 (creator_code:org_t)
ISBN 9781479936229
2014
2014
English.
In: Technical Digest - IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC. - 1550-8781. - 9781479936229
  • Conference paper (peer-reviewed)
Abstract Subject headings
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  • A highly integrated chipset comprising a transmitter (TX) and a receiver (RX) chip, based on a 250 nm InP DHBT technology for high data rate D-band (110-170 GHz) wireless communication is described. The chipset is designed for point-to-point wireless communication for 4G and 5G mobile communication infrastructure, high data rate backhaul, low-latency wireless HDTV transmission and >40 Gbps transmission over dielectric waveguide. The measured RX conversion gain is 26 dB, with a noise figure of 9 dB. The measured TX conversion gain is 20 dB. A maximum QPSK data rate of 44 Gbps is demonstrated, which exceeds the present state-of-the art in the D-band by a factor of 2.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Keyword

InP DHBT
D-band
Wireless communication
RX/TX
QPSK
BPSK

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kon (subject category)
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