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A highly integrated...
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Carpenter, Sona,1983Chalmers tekniska högskola,Chalmers University of Technology
(author)
A highly integrated chipset for 40 Gbps wireless D-band communication based on a 250 nm InP DHBT technology
- Article/chapterEnglish2014
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LIBRIS-ID:oai:research.chalmers.se:847e1727-505f-4d0e-a63f-3eae17660a77
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ISBN:9781479936229
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https://research.chalmers.se/publication/210680URI
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https://doi.org/10.1109/CSICS.2014.6978535DOI
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Language:English
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Summary in:English
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Subject category:kon swepub-publicationtype
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Subject category:ref swepub-contenttype
Notes
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A highly integrated chipset comprising a transmitter (TX) and a receiver (RX) chip, based on a 250 nm InP DHBT technology for high data rate D-band (110-170 GHz) wireless communication is described. The chipset is designed for point-to-point wireless communication for 4G and 5G mobile communication infrastructure, high data rate backhaul, low-latency wireless HDTV transmission and >40 Gbps transmission over dielectric waveguide. The measured RX conversion gain is 26 dB, with a noise figure of 9 dB. The measured TX conversion gain is 20 dB. A maximum QPSK data rate of 44 Gbps is demonstrated, which exceeds the present state-of-the art in the D-band by a factor of 2.
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He, Zhongxia Simon,1984Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)zhongxia
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Bao, M.Telefonaktiebolaget L M Ericsson,Ericsson
(author)
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Zirath, Herbert,1955Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)zirath
(author)
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Chalmers tekniska högskolaTelefonaktiebolaget L M Ericsson
(creator_code:org_t)
Related titles
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In:Technical Digest - IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC1550-87819781479936229
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