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Development and Cha...
Development and Characterization of Carbon Nanotube-based Bumps for Ultra Fine Pitch Flip Chip Interconnection
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- Wang, Teng, 1983 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Carlberg, Björn, 1983 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- 2007
- 2007
- English.
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In: Proceedings of the 16th European Microelectronics and Packaging Conference & Exhibition: EMPC2007.
- Related links:
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Subject headings
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Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Publication and Content Type
- kon (subject category)
- ref (subject category)
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