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Design of Flip-Chip...
Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V-Band Frequencies With Excellent Reliability
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- Hsu, Li-Han, 1981 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Wu, Wei-Cheng, 1979 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Chang, E. Y. (author)
- National Chiao Tung University
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- Zirath, Herbert, 1955 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Hu, Y. C. (author)
- National Chiao Tung University
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- Wang, C. T. (author)
- National Chiao Tung University
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- Wu, Y. C. (author)
- National Chiao Tung University
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- Tsai, S. P. (author)
- National Chiao Tung University
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(creator_code:org_t)
- 2010
- 2010
- English.
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In: IEEE Transactions on Microwave Theory and Techniques. - 0018-9480 .- 1557-9670. ; 58:8, s. 2244-2250
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http://dx.doi.org/10...
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https://doi.org/10.1...
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Abstract
Subject headings
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- This study demonstrates a flip-chip interconnect with epoxy-based underfill (epsilon(r) = 3.5 and tan delta = 0.02 at 10 MHz) for packaging applications up to V-band frequencies. To achieve the best interconnect performance, both the matching designs on GaAs chip and Al2O3 substrate were adopted with the underfill effects taken into consideration. The optimized flip-chip interconnect showed excellent performance from dc to 67 GHz with return loss below -20 dB and insertion loss less than 0.6 dB. Furthermore, the dielectric loss induced by the underfill was extracted from measurement and compared with the simulation results. The reliability tests including 85 degrees C/85 % relative humidity test, thermal cycling test, and shear force test were performed. For the first time, the S-parameters measurement was performed to check the flip-chip reliability, and no performance decay was observed after 1000 thermal cycles. Moreover, the mechanical strength was improved about 12 times after the underfill was applied. The results show that the proposed flip-chip architecture has excellent reliability and can be applied for commercial applications.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Keyword
- underfill
- interconnect
- flip-chip
- reliability
- millimeter wave (MMW)
- Design
- V-band
- ghz
- epoxy resin
- packaging
Publication and Content Type
- art (subject category)
- vet (subject category)
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- By the author/editor
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Hsu, Li-Han, 198 ...
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Wu, Wei-Cheng, 1 ...
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Chang, E. Y.
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Zirath, Herbert, ...
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Hu, Y. C.
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Wang, C. T.
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show more...
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Wu, Y. C.
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Tsai, S. P.
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show less...
- About the subject
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- ENGINEERING AND TECHNOLOGY
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ENGINEERING AND ...
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and Electrical Engin ...
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IEEE Transaction ...
- By the university
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Chalmers University of Technology