Reduction of thermal resistance of Ag-coated GFs/copper structure using nano-Ag paste as interconnection

• Reduction of the thermal resistance between graphene films (GFs) and substrate is crucial to the application of GFs in thermal management. GFs/copper structures were prepared using nano-Ag paste as interconnection material. The effect of the thickness of nano-Ag paste on thermal resistance of GFs/copper structure was investigated. A thin layer of Ag was coated on GFs by physical vapor deposition (PVD) to further reduce thermal resistance. The thermal resistance of GFs/copper structure using Ag-coated GFs is 5.84% lower than that using raw GFs. The thermal resistance of GFs/copper structure decreases first and then increases with the increase of coating temperature and thickness of Ag layer. The minimum thermal resistance of 1.64 mm2·K·W-1 was gained for GFs/copper structure using GFs coated Ag at 300 ℃ for 60 min.

Subject headings

NATURVETENSKAP  -- Kemi -- Oorganisk kemi (hsv//swe)

NATURAL SCIENCES  -- Chemical Sciences -- Inorganic Chemistry (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Materialteknik -- Bearbetnings-, yt- och fogningsteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Materials Engineering -- Manufacturing, Surface and Joining Technology (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Materialteknik -- Annan materialteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Materials Engineering -- Other Materials Engineering (hsv//eng)

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