Low temperature full wafer adhesive bonding of structured wafers

Niklaus, Frank (author)

Enoksson, Peter, 1957 (author): Chalmers tekniska högskola,Chalmers University of Technology

Griss, Patrick (author)

Kälvesten, Edvard, 1967 (author)

Stemme, Göran, 1958 (author)

Andersson, Helene (author)

(creator_code:org_t)

2001
2001
English.
In: The 11th International Conference on Solid-State Sensors and Actuators (TRANSDUCERS'01 / Eurosensors XV), Munich, Germany. ; 92, s. 235-241

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Subject headings

TEKNIK OCH TEKNOLOGIER -- Maskinteknik (hsv//swe)
ENGINEERING AND TECHNOLOGY -- Mechanical Engineering (hsv//eng)
TEKNIK OCH TEKNOLOGIER -- Materialteknik (hsv//swe)
ENGINEERING AND TECHNOLOGY -- Materials Engineering (hsv//eng)
TEKNIK OCH TEKNOLOGIER -- Annan teknik (hsv//swe)
ENGINEERING AND TECHNOLOGY -- Other Engineering and Technologies (hsv//eng)
TEKNIK OCH TEKNOLOGIER -- Kemiteknik (hsv//swe)
ENGINEERING AND TECHNOLOGY -- Chemical Engineering (hsv//eng)
TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
TEKNIK OCH TEKNOLOGIER -- Annan teknik -- Övrig annan teknik (hsv//swe)
ENGINEERING AND TECHNOLOGY -- Other Engineering and Technologies -- Other Engineering and Technologies not elsewhere specified (hsv//eng)

By the author/editor: Niklaus, Frank; Enoksson, Peter, ...; Griss, Patrick; Kälvesten, Edvar ...; Stemme, Göran, 1 ...; Andersson, Helen ...

About the subject

ENGINEERING AND TECHNOLOGY: ENGINEERING AND ...; and Other Engineerin ...; and Other Engineerin ...

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