Search: onr:"swepub:oai:research.chalmers.se:9dec3cdd-d55e-425f-8436-6ef96df0bcf6" >
Reliability of Carb...
Reliability of Carbon Nanotube Bumps for Chip on Film Application
-
- Li, X. (author)
- Shanghai University
-
- Mu, Wei, 1985 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
-
- Jiang, Di, 1983 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
-
show more...
-
- Fu, Yifeng, 1984 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
-
- Zhang, Yan, 1976 (author)
- Shanghai University
-
- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
-
show less...
-
(creator_code:org_t)
- ISBN 9781479906758
- 2013
- 2013
- English.
-
In: Proceedings of the IEEE Conference on Nanotechnology. - 1944-9399 .- 1944-9380. - 9781479906758 ; , s. 845-848
- Related links:
-
http://dx.doi.org/10...
-
show more...
-
https://doi.org/10.1...
-
https://research.cha...
-
show less...
Abstract
Subject headings
Close
- Carbon nanotubes (CNTs) are an ideal candidate for electrical interconnects due to their extraordinary thermal, electrical and mechanical properties. In this work, as-densified CNT bumps were applied as chip on film (COF) interconnection material. A silicon chip with patterned CNT bumps was bonded onto a flexible substrate using anisotropic conductive adhesive (ACA) with bonding pressure, at 127.4 MPa, 170 °C and for 8 seconds. The electrical properties of this structure were evaluated by measuring the contact resistance of each bump using the four-point probe method. Thermal cycling (-40∼85°C, 1000 cycles) and damp heat tests (85°C/85% RH, 1000 hours) were conducted to evaluate the reliabilities of the CNT-COF structure bonded with ACA. The average contact resistances of two samples used for the reliability tests were 226 mΩ and 260mΩ. No electrical failure was observed after the damp heat test and only two were observed after the thermal cycling test. The average contact resistance was increased only 15.7% and 13.8%, respectively, after the thermal cycling and the damp heat tests. © 2013 IEEE.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Nanoteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Nano-technology (hsv//eng)
Publication and Content Type
- kon (subject category)
- ref (subject category)
Find in a library
To the university's database
- By the author/editor
-
Li, X.
-
Mu, Wei, 1985
-
Jiang, Di, 1983
-
Fu, Yifeng, 1984
-
Zhang, Yan, 1976
-
Liu, Johan, 1960
- About the subject
-
- ENGINEERING AND TECHNOLOGY
-
ENGINEERING AND ...
-
and Nano technology
- Articles in the publication
-
Proceedings of t ...
- By the university
-
Chalmers University of Technology