Ultra-clean Si/Si interface formation by surface preparation and direct bonding in ultra-high vacuum

• Silicon surfaces have been cleaned and bonded in ultra-high vacuum at a pressure in the 10-10 torr range. The bonded interfaces show extremely low contamination levels as measured by secondary ion mass spectroscopy. Nevertheless, a potential barrier could be detected at the interface spreading resistance and current vs. temperature measurements. This suggests that the barrier is caused by inevitable dislocation networks due to wafer misorientation, as well as residual oxygen at the interface

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Keyword

wafer bonding

dislocations

electric current

surface contamination

secondary ion mass spectra

vacuum techniques

surface cleaning

silicon

interface structure

mass spectroscopic chemical analysis

electric resistance

elemental semiconductors

Publication and Content Type

kon (subject category)

ref (subject category)