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Study of interfacia...
Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate
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- Chen, Si, 1981 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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Sun, Peng (author)
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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Wei, Xiecheng (author)
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Cheng, Zhaonian, 1942 (author)
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Shangguan, Dongkai (author)
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(creator_code:org_t)
- 2006
- 2006
- English.
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In: Proceedings of the 2006 7th International Conference on Electronics Packaging Technology. ; , s. 368-373
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Subject headings
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Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Materialteknik -- Annan materialteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering -- Other Materials Engineering (hsv//eng)
Publication and Content Type
- kon (subject category)
- ref (subject category)
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