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Use of carbon nanotubes in potential electronics packaging applications

Liu, Johan, 1960 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Wang, Teng, 1983 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Fu, Yifeng, 1984 (author)
Chalmers tekniska högskola,Chalmers University of Technology
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Ye, L. (author)
SHT Smart High-Tech AB
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 (creator_code:org_t)
ISBN 9781424470334
2010
2010
English.
In: 2010 10th IEEE Conference on Nanotechnology, NANO 2010. - 9781424470334 ; , s. 160-166
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Abstract Subject headings
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  • Packaging of electronics is an important technology to interconnect, power, cool and protect the components in highly integrated systems. Continuous size shrinking and function integration of future electronics are expected to be driven mainly by the advances in packaging technology. Carbon nanotubes (CNTs) are proposed for many novel packaging solutions thanks to their unique electrical, thermal, and mechanical properties. This paper introduces potential use of CNTs in electronics packaging, in both interconnection and thermal management applications. The challenges of fully exploiting the great potential of CNTs in this field are also discussed.

Subject headings

NATURVETENSKAP  -- Fysik (hsv//swe)
NATURAL SCIENCES  -- Physical Sciences (hsv//eng)

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By the author/editor
Liu, Johan, 1960
Wang, Teng, 1983
Fu, Yifeng, 1984
Ye, L.
About the subject
NATURAL SCIENCES
NATURAL SCIENCES
and Physical Science ...
Articles in the publication
2010 10th IEEE C ...
By the university
Chalmers University of Technology

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