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Novel nanostructure...
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Hansson, Josef,1991Chalmers tekniska högskola,Chalmers University of Technology
(author)
Novel nanostructured thermal interface materials: a review
- Article/chapterEnglish2018
Publisher, publication year, extent ...
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2017-04-19
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Informa UK Limited,2018
Numbers
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LIBRIS-ID:oai:research.chalmers.se:ba4cbda7-b84d-4152-bb6f-d27a435c1994
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https://research.chalmers.se/publication/254372URI
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https://doi.org/10.1080/09506608.2017.1301014DOI
Supplementary language notes
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Language:English
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Summary in:English
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Subject category:for swepub-publicationtype
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Subject category:ref swepub-contenttype
Notes
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The trend of continuing miniaturisation of microelectronics leads to new thermal management challenges. A key point in the heat removal process development is to improve the heat conduction across interfaces through improved thermal interface materials (TIMs). We identify the key areas for state-of-the art TIM research and investigate the current state of the field together with possible future advances.
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Added entries (persons, corporate bodies, meetings, titles ...)
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Nilsson, Torbjörn M. J.,1962Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)tornilss
(author)
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Ye, L.SHT Smart High-Tech AB
(author)
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Liu, Johan,1960Shanghai University,Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)jliu
(author)
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Chalmers tekniska högskolaSHT Smart High-Tech AB
(creator_code:org_t)
Related titles
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In:International Materials Reviews: Informa UK Limited63:1, s. 22-450950-66081743-2804
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