High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO Applications

• In this paper, a planar spiral resonator operating at 13 GHz is investigated. The resonator was fabricated using fan-out wafer level packaging (FoWLP) technology. The field analysis highlights the importance of via fence. Two thick film resistors suppress an undesired resonance in proximity of targeted one. The measurements demonstrate a very good correlation in comparison with full-wave simulations. The measured Q-factor defined based on analysis of feedback oscillatory system is about 48. The proposed configuration is suitable for voltage-controlled oscillators (VCOs) with a resonator realized in package.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Kommunikationssystem (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Communication Systems (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Keyword

Q-factor

Ku-band

fan-out wafer level packaging

resonator

VCO

Publication and Content Type

art (subject category)

ref (subject category)