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The effect of bump ...
The effect of bump height on the reliability of ACF in flip-chip
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Wu, C.M.L (author)
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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Yeung, N. H (author)
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(creator_code:org_t)
- 2001
- 2001
- English.
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In: Soldering & Surface Mount Technology. ; , s. 25-30
- Related links:
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https://research.cha...
Subject headings
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Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Publication and Content Type
- art (subject category)
- ref (subject category)
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