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Process development and adhesion behaviour of Electroless Copper on Liquid Crystal Polymer (LCP) for Electronic Packaging Application
- Chen, Liu (author)
- Crinic, Midhat (author)
-
- Lai, Zonghe, 1948 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- 2002
- 2002
- English.
- In: IEEE Transactions on Electronics Packaging Manufacturing. ; 25, s. 247-278
- Journal article (peer-reviewed)
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Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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- ref (subject category)
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- Chen, Liu
- Crinic, Midhat
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- Liu, Johan, 1960
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- Chalmers University of Technology
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