Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

Sun, Shuangxi,1986Chalmers tekniska högskola,Chalmers University of Technology (author)

This paper presents a novel nanocomposite thermal interface material (Nano-TIM) consisting of a silver coated polyimide network and the indium matrix. One of the potential applications of this Nano-TIM is for heat dissipation in integrated circuits and electronic packaging. The shear strength of the Nano-TIM was investigated with DAGE-4000PSY shear tester. The shear strength of Nano-TIM is 4.5 MPa, which is 15% higher than that of the pure indium thermal interface material. The microstructure of cross-section and fracture surface was studied using Scanning Electron Microscopy (SEM). SEM pictures show a uniform polymer fiber distribution and solid interface between silver coated fibers and indium matrix. The thermal fatigue resistance of the Nano-TIM was evaluated by monitoring the variation of thermal interface resistance during the thermal cycling test (-40 to 125 degrees C). The thermal interface resistance was measured with a commercial xenon flash instrument after 100, 200, 300, 400, 500, and 1000 temperature cydes. The results-of thermal cycling test show that Nano-TIM presented consistent reliability performance with pure indium. Furthermore, the tooling effect of Nano-TIM was demonstrated through measuring the power chip temperature in the die attached structure by using an Infrared Camera. In the test, the Nano-TIM shows a comparable cooling effect to pure indium TIM for die attach applications in electronics packaging.

Chen, Si,1981Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)sich (author)
Luo, Xin,1983Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)xinlu (author)
Fu, Yifeng,1984Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)yifeng (author)
Ye, L.SHT Smart High-Tech AB (author)
Liu, Johan,1960Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)jliu (author)
Chalmers tekniska högskolaSHT Smart High-Tech AB (creator_code:org_t)

By the author/editor: Sun, Shuangxi, 1 ...; Chen, Si, 1981; Luo, Xin, 1983; Fu, Yifeng, 1984; Ye, L.; Liu, Johan, 1960

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