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  • Duan, Junmei (author)

Microsystem Manufacturing, Assembly and Packaging Technology in Display-CardTM Applications

  • Article/chapterEnglish2004

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  • 2004

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  • LIBRIS-ID:oai:research.chalmers.se:da694006-0362-45ba-93b8-9dcebf2cd151
  • https://research.chalmers.se/publication/3243URI

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  • Language:English

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  • Subject category:kon swepub-publicationtype
  • Subject category:ref swepub-contenttype

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  • Asplund, Johan (author)
  • Liu, Johan,1960Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)jliu (author)
  • Chalmers tekniska högskola (creator_code:org_t)

Related titles

  • In:Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4)04:EX905, s. pp 290-293

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Duan, Junmei
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Liu, Johan, 1960
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ENGINEERING AND TECHNOLOGY
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and Electrical Engin ...
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Chalmers University of Technology

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