Search: onr:"swepub:oai:research.chalmers.se:da694006-0362-45ba-93b8-9dcebf2cd151" >
Microsystem Manufac...
Microsystem Manufacturing, Assembly and Packaging Technology in Display-CardTM Applications
- Article/chapterEnglish2004
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LIBRIS-ID:oai:research.chalmers.se:da694006-0362-45ba-93b8-9dcebf2cd151
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https://research.chalmers.se/publication/3243URI
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Subject category:kon swepub-publicationtype
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Asplund, Johan
(author)
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Liu, Johan,1960Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)jliu
(author)
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Chalmers tekniska högskola
(creator_code:org_t)
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In:Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4)04:EX905, s. pp 290-293
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