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Reliability of ACA flip-chip joints on FR-4 substrate
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Lai, Zonghe, 1948 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
- (creator_code:org_t)
- 2002
- 2002
- English.
- In: Journal of Electronics packaging. ; , s. 240-245
- Journal article (peer-reviewed)
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Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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- art (subject category)
- ref (subject category)
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