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Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader

Liu, Ya, 1991 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Wang, Nan (author)
Ye, L. (author)
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Zehri, Abdelhafid, 1989 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Nylander, Andreas, 1988 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Nkansah, Amos (author)
Lu, Hongbin (author)
Fudan University
Liu, Johan, 1960 (author)
Chalmers tekniska högskola,Chalmers University of Technology,Shanghai University
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 (creator_code:org_t)
2019
2019
English.
In: Advancing Microelectronics. - 2222-8748. ; 2019:NOR, s. 1-5
  • Journal article (peer-reviewed)
Abstract Subject headings
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  • Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400 - 800 W m−1 K−1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m-1 K-1 and 0.485 W m-1 K-1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Materialteknik -- Textil-, gummi- och polymermaterial (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Materials Engineering -- Textile, Rubber and Polymeric Materials (hsv//eng)
NATURVETENSKAP  -- Kemi -- Materialkemi (hsv//swe)
NATURAL SCIENCES  -- Chemical Sciences -- Materials Chemistry (hsv//eng)
TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Keyword

thermal management
electrical resistvity
PVP/BN composite film; orientation
die attach

Publication and Content Type

art (subject category)
ref (subject category)

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