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Thermally Conductiv...
Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader
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- Liu, Ya, 1991 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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Wang, Nan (author)
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Ye, L. (author)
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- Zehri, Abdelhafid, 1989 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Nylander, Andreas, 1988 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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Nkansah, Amos (author)
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- Lu, Hongbin (author)
- Fudan University
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology,Shanghai University
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(creator_code:org_t)
- 2019
- 2019
- English.
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In: Advancing Microelectronics. - 2222-8748. ; 2019:NOR, s. 1-5
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https://doi.org/10.4...
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Abstract
Subject headings
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- Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400 - 800 W m−1 K−1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m-1 K-1 and 0.485 W m-1 K-1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Materialteknik -- Textil-, gummi- och polymermaterial (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering -- Textile, Rubber and Polymeric Materials (hsv//eng)
- NATURVETENSKAP -- Kemi -- Materialkemi (hsv//swe)
- NATURAL SCIENCES -- Chemical Sciences -- Materials Chemistry (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Keyword
- thermal management
- electrical resistvity
- PVP/BN composite film; orientation
- die attach
Publication and Content Type
- art (subject category)
- ref (subject category)
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- By the author/editor
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Liu, Ya, 1991
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Wang, Nan
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Ye, L.
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Zehri, Abdelhafi ...
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Nylander, Andrea ...
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Nkansah, Amos
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show more...
-
Lu, Hongbin
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Liu, Johan, 1960
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show less...
- About the subject
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- ENGINEERING AND TECHNOLOGY
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ENGINEERING AND ...
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and Materials Engine ...
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and Textile Rubber a ...
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- NATURAL SCIENCES
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NATURAL SCIENCES
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and Chemical Science ...
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and Materials Chemis ...
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- ENGINEERING AND TECHNOLOGY
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ENGINEERING AND ...
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and Electrical Engin ...
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and Other Electrical ...
- Articles in the publication
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Advancing Microe ...
- By the university
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Chalmers University of Technology