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  • Liu, Ya,1991Chalmers tekniska högskola,Chalmers University of Technology (author)

Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader

  • Article/chapterEnglish2019

Publisher, publication year, extent ...

  • 2019

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  • LIBRIS-ID:oai:research.chalmers.se:ff99c907-e300-4505-b846-4d2a611bca88
  • https://doi.org/10.4071/2380-4491-2019-NOR-LiuDOI
  • https://research.chalmers.se/publication/540592URI

Supplementary language notes

  • Language:English
  • Summary in:English

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  • Subject category:art swepub-publicationtype
  • Subject category:ref swepub-contenttype

Notes

  • Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400 - 800 W m−1 K−1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m-1 K-1 and 0.485 W m-1 K-1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.

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  • Wang, Nan (author)
  • Ye, L. (author)
  • Zehri, Abdelhafid,1989Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)hafid (author)
  • Nylander, Andreas,1988Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)nylandea (author)
  • Nkansah, Amos (author)
  • Lu, HongbinFudan University (author)
  • Liu, Johan,1960Chalmers tekniska högskola,Chalmers University of Technology,Shanghai University(Swepub:cth)jliu (author)
  • Chalmers tekniska högskolaFudan University (creator_code:org_t)

Related titles

  • In:Advancing Microelectronics2019:NOR, s. 1-52222-8748

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