| 41. |
- Manchili, Swathi Kiranmayee, 1987, et al.
(author)
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Effect of Nanopowder Addition on the Sintering of Water-Atomized Iron Powder
- 2020
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In: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science. - : Springer Science and Business Media LLC. - 1073-5623. ; 51:9, s. 4890-4901
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Journal article (peer-reviewed)abstract
- A promising method of improving the densification of powder metallurgical steel components is to blend nanopowder with the otherwise typically used micrometre-sized powder. The higher surface-to-volume ratio of nanopowder is hypothesized to accelerate the sintering process and increase the inter-particle contact area between the powder particles. This is supposed to enhance the material transport and improve the densification. In the present investigation, water-atomized iron powder (− 45 μm) was mixed separately with pure iron and low-carbon steel nanopowder, each at a ratio of 95 to 5 pct. These powder mixes were compacted at different pressures (400, 600 and 800 MPa) and then sintered at 1350 °C in a pure hydrogen atmosphere. The sintering behavior of the powder blend compacts was compared to that of the compact with micrometre-sized powder only. Densification commenced at much lower temperatures in the presence of nanopowder. To understand this, sintering at intermittent temperatures such as 500 °C and 700 °C was conducted. The fracture surface revealed that the nanopowder was sintered at between 500 °C and 700 °C, which in turn contributed to the densification of the powder mix at the lower temperature range. Based on the sintering experiments, an attempt was made to calculate the activation energy and identify the associated sinter mechanism using two different approaches. It was shown that the first approach yielded values in agreement with the grain-boundary diffusion mechanism. As the nanopowder content increased, there was an increase in linear shrinkage during sintering.
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| 42. |
- Middeldorp, Christel M., et al.
(author)
-
The Early Growth Genetics (EGG) and EArly Genetics and Lifecourse Epidemiology (EAGLE) consortia : design, results and future prospects
- 2019
-
In: European Journal of Epidemiology. - : Springer Science and Business Media LLC. - 0393-2990 .- 1573-7284. ; 34:3, s. 279-300
-
Journal article (peer-reviewed)abstract
- The impact of many unfavorable childhood traits or diseases, such as low birth weight and mental disorders, is not limited to childhood and adolescence, as they are also associated with poor outcomes in adulthood, such as cardiovascular disease. Insight into the genetic etiology of childhood and adolescent traits and disorders may therefore provide new perspectives, not only on how to improve wellbeing during childhood, but also how to prevent later adverse outcomes. To achieve the sample sizes required for genetic research, the Early Growth Genetics (EGG) and EArly Genetics and Lifecourse Epidemiology (EAGLE) consortia were established. The majority of the participating cohorts are longitudinal population-based samples, but other cohorts with data on early childhood phenotypes are also involved. Cohorts often have a broad focus and collect(ed) data on various somatic and psychiatric traits as well as environmental factors. Genetic variants have been successfully identified for multiple traits, for example, birth weight, atopic dermatitis, childhood BMI, allergic sensitization, and pubertal growth. Furthermore, the results have shown that genetic factors also partly underlie the association with adult traits. As sample sizes are still increasing, it is expected that future analyses will identify additional variants. This, in combination with the development of innovative statistical methods, will provide detailed insight on the mechanisms underlying the transition from childhood to adult disorders. Both consortia welcome new collaborations. Policies and contact details are available from the corresponding authors of this manuscript and/or the consortium websites.
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| 43. |
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| 44. |
- Mo, Zhimin, et al.
(author)
-
Integrating nano carbon tubes with microchannel cooler
- 2004
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In: Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4). ; 04:EX905, s. pp 373-376
-
Conference paper (peer-reviewed)
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| 45. |
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| 46. |
- Shen, Zhiyang, et al.
(author)
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Novel Lightweight, Highly Thermally Conductive Graphene-Enhanced Heat Pipes for Electronics Cooling and Thermal Management Applications
- 2024
-
In: 2024 International Conference on Electronics Packaging, ICEP 2024. ; , s. 339-340
-
Conference paper (peer-reviewed)abstract
- As electronic equipment becomes increasingly lightweight, miniaturized, and highly integrated, the heat dissipation challenges of electronic devices become increasingly greater. Heat pipes are among the most efficient heat-conducting elements. However, conventional heat pipes are gradually unable to meet the heat dissipation needs and lightweight requirements of electronic devices due to limitations in the intrinsic thermal conductivity of the metal and weight constraints. Therefore, it is imperative to explore new high thermal conductivity and lightweight heat pipes. This paper developed a new graphene-reinforced nickel-based heat pipe and a graphene-reinforced aluminum-based heat pipe. The results show that the two graphene-reinforced heat pipes significantly reduce the mass of the heat pipe and improve the heat transfer performance of the heat pipe.
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| 47. |
- Sun, Jie, 1977, et al.
(author)
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Direct Chemical Vapor Deposition of Large-Area Carbon Thin Films on Gallium Nitride for Transparent Electrodes: A First Attempt
- 2012
-
In: IEEE Transactions on Semiconductor Manufacturing. - : Institute of Electrical and Electronics Engineers (IEEE). - 0894-6507 .- 1558-2345. ; 25:3, s. 494-501
-
Journal article (peer-reviewed)abstract
- Direct formation of large-area carbon thin films on gallium nitride by chemical vapor deposition without metallic catalysts is demonstrated. A high flow of ammonia is used to stabilize the surface of the GaN (0001)/sapphire substrate during the deposition at 950 degrees C. Various characterization methods verify that the synthesized thin films are largely sp(2) bonded, macroscopically uniform, and electrically conducting. The carbon thin films possess optical transparencies comparable to that of exfoliated graphene. This paper offers a viable route toward the use of carbon-based materials for future transparent electrodes in III-nitride optoelectronics, such as GaN-based light emitting diodes and laser diodes.
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| 48. |
- Tao, W., et al.
(author)
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Reliability characterisation of bi-modal high temperature stable Isotropic Conductive Adhesives
- 2010
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In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xian, 16-19 August 2010. - 9781424481422 ; :Article number 5582437, s. 225-228
-
Conference paper (peer-reviewed)abstract
- Conductive adhesives are generally considered to be one of the strongest candidates for replacement of solder in electronics industry. However, some problems related to the performance have so far limited wider applications of conductive adhesives. One of the major problems is tendency to degrade during temperature and humidity aging. In this paper, two kinds of Isotropic Conductive Adhesives (ICA) with high temperature stable matrix and different fillers were fabricated. The first one was fabricated by simply adding silver flakes into matrix as filler using this high temperature stable matrix based on highly cross-linked aromatic functional groups. For the second one, in addition to silver flakes, nanosilver particles with different weight percentages were also added as filler into matrix to form a bi-modal ICA. The weight percentages of nano-silver particles in filler are 1wt%, 2wt% and 3wt% respectively. The filler content of these two ICAs are both 75wt% in total. All test samples were cured at 150°for 1 hour. The random distribution of the silver flakes in the adhesive was observed by SEM. The bulk resistivity of the ICAs with different fillers was investigated to characterize the electrical conductivity of the ICA. The results show that addition of small amount of nano-silver particles improve the electric conductivity of the ICA but the excessive amount of nano-silver particles led to the increase of the ICA's bulk resistivity. The humidity (85°/85RH) test was carried out and the resistances of the samples were measured. It was shown that some electrical resistance increase was observed during the humidity testing with time. The addition of the nano-particles has also some negative effect of the electrical resistance change. But the effect is limited in a few percentage range of the nano-particle addition.
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| 49. |
- Wang, Nan, et al.
(author)
-
Highly thermal conductive and electrically insulated graphene based thermal interface material with long-term reliability
- 2019
-
In: Proceedings - Electronic Components and Technology Conference. - 0569-5503. ; 2019-May, s. 1564-1568
-
Conference paper (peer-reviewed)abstract
- High density packaging in combination with increased transistor integration inevitably leads to challenging power densities in terms of thermal management. The conventional TIMs that are widely used in the microelectronic industry today are experiencing more and more stress due to their limited thermal performance and poor reliability. Composed by particle laden polymer matrix, thermal conductivity (K) of conventional TIMs is generally limited to 5 W/mK, and such values can be even lower for electrically insulated TIMs. Conventional TIMs also suffer from severe pump-out and dry-out failures, which brought great threat to the performance and lifetime of the electronic devices. Here, we solve these problems by applying a novel highly thermal conductive, electrically insulated and reliable graphene based TIMs (I-GTs). Composed by vertical graphene structures, I-GTs provide a continuous heat pathway from top to bottom, which enables superfast heat dissipation at through-plane direction. The highest bulk through-plane thermal conductivity of the conductive body can reach up to 1000 W/mK, which is orders of magnitude higher than conventional TIMs, and even outperforms the pure indium TIMs by over ten times. The highly flexible and foldable nature of I-GT enables at least 100% compressibility upon small applied pressures. As excellent gap fillers, I-GT can provide complete physical contact between two surfaces and thereby minimize the contact resistance to heat flow. The measured minimum thermal resistance for I-GTs reaches about 30 Kmm2/W. Such values are significantly higher than the randomly dispersed composites presented above. To ensure fully electrical insulation, a smooth and soft adhesive layer with a thickness of few microns was coated on the surface of I-GT. The breakdown voltage of I-GT reaches up to 950 V. Thermal cycling test shows the highly stable nature of I-GT. The good compressibility and elasticity of I-GT ensures continued proper TIM contact with substrates, which counteracts the effect of internal stress induced by the mismatch of coefficient of thermal expansion (CTE) during temperature cycling. In addition, the I-GTs have the advantages of low density and good maintainability. The resulting I-GTs thus opens new opportunities for addressing large heat dissipation issues for form-factor driven electronics and other high power driven systems.
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| 50. |
- Wang, Nan, et al.
(author)
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Highly Thermal Conductive and Light -weight Craphene-based Heatsink
- 2019
-
In: 2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC). - 2165-2341. - 9780956808660
-
Conference paper (peer-reviewed)abstract
- With the developing trend ofminiaturization and integration of modem electronic devices, commercial hearsinks ivaterigh, like copper and ii iv are facing mare and mare challenges, such as inefficient cooling performance, large size turd heavy weight. Here, we salve the probletn by developing a novel highly thermal conductive and 11Mo-weight graphene heatsink. Cornposed by vertically-aligned and continUOUS graphene structures, heat transport was highly efficiero from the base 1o fin Ii: ininside the heatsink, The maximum through-platre thermal catuluctivity ofgraphene heatsink can be up to 1000 1500 Ward( which is over 7 times higher than aluminum, and even outperforms copper about 4 times_ Gmphene heatsink demonstrated outstanding cooling perffrmance which wm superior to copper heatsink with the same dimension and same power input. Noticeably, the graphene hearsink also has anportant advantagas of light-weight and high emissions,. The measured density (1 1 g cmli is only onroeighth of copper and lam than hoor of aluminum and emissivity is about ten times hiher than pure rapper and aluminum. The resulting graphene heatsink thus opertS rim opportunities for addressing large heat dissMatMn issues in weight' driven electronics and othm high power smions.
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