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Träfflista för sökning "WFRF:(Lai Zonghe 1948) srt2:(2000-2004)"

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Enumeration	Reference	Cover	Find
1.	Andersson, Cristina, 1969, et al. (author) Low-Cycle fatigue life of SnAgBi and Sn-Ag lead-free solders 2001 In: Proceedings of the IMAPS Nordic. ; , s. 298-303 Conference paper (peer-reviewed)
2.	Andersson, Cristina, 1969, et al. (author) Low Cycle fatigue of lead-free solders 2001 In: The Fourth International Symposium on Electronic Packaging Technology. ; , s. 462-470 Conference paper (peer-reviewed)
3.	Cao, Liqiang, 1974, et al. (author) Effect of Curing Condition of Adhesion Strength and ACA Flip Chip Contact Resistance 2004 In: Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4). ; 04:EX905, s. pp 254-258 Conference paper (peer-reviewed)
4.	Cao, Liqiang, 1974, et al. (author) Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate using the peel test with different moisture environment 2003 In: Polytroni´03. ; , s. 309-313 Conference paper (peer-reviewed)
5.	Chen, Liu, et al. (author) Process development and adhesion behaviour of Electroless Copper on Liquid Crystal Polymer (LCP) for Electronic Packaging Application 2002 In: IEEE Transactions on Electronics Packaging Manufacturing. ; 25, s. 247-278 Journal article (peer-reviewed)
6.	Chen, Liu, 1973, et al. (author) Process Development and Reliability for System-in-a-Package Using Liquid Crystal Polymer Substrate 2004 In: ECTC04. ; , s. pp 24-28 Conference paper (peer-reviewed)
7.	Chen, Liu, 1973, et al. (author) Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection 2004 In: Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´04). Conference paper (peer-reviewed)
8.	Fu, Ying, et al. (author) Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesives 2000 In: IEEE CPMT transactions, Part B: Advanced Packaging. ; 23, s. 15-21 Journal article (peer-reviewed)
9.	Kang, Yilan, et al. (author) Experimental and Theoretical Analysis for Material Behavior of Anisotropically Conductive Adhesive Film 2002 In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP´02). ; , s. 123-125 Conference paper (peer-reviewed)
10.	Liu, Johan, 1960, et al. (author) Reliability of ACA flip-chip joints on FR-4 substrate 2002 In: Journal of Electronics packaging. ; , s. 240-245 Journal article (peer-reviewed)

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Result 1-10 of 21

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Type of publication: conference paper (13); journal article (8)

Type of content: peer-reviewed (21)

Author/Editor: Liu, Johan, 1960 (21); Lai, Zonghe, 1948 (21); Wang, Xitao (6); Andersson, Cristina, ... (3); Willander, Magnus (2); Chen, Liu, 1973 (2); show more...; Cao, Liqiang, 1974 (2); Chen, Liu (2); Kang, Yi Lan (2); Li, S. (1); Zheng, Lirong (1); Grönqvist, Hans (1); Li, Shiming, 1947 (1); Zou, Gang, 1970 (1); Ye, L (1); Cheng, Zhaonian, 194 ... (1); Södervall, Ulf, 1954 (1); Fu, Ying (1); Wang, Yanli (1); Chen, Guoliang (1); Liu, Sheng (1); Crinic, Midhat (1); Duo, Xingzhong (1); Ye, Lilei (1); Thölen, A. (1); Qiu, Yu (1); Wang, Tiebing (1); Ye, L. L. (1); Pinardi, K (1); Kang, Yilan (1); Zhang, Zhifeng (1); Mo, Zhimin (1); Mo, Z. (1); Nysæther, Jon B (1); Pinardi, Kuntjoro (1); Vogel, Dietmar (1); Haug, Ralf (1); show less...

University: Chalmers University of Technology (21)

Language: English (21)

Research subject (UKÄ/SCB): Engineering and Technology (21); Medical and Health Sciences (1)

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