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A non-galvanic D-ba...
A non-galvanic D-band MMIC-to-waveguide transition using eWLB packaging technology
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- Hassona, Ahmed Adel, 1988 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- He, Zhongxia Simon, 1984 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Mariotti, C. (författare)
- Infineon Technologies AG
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- Dielacher, F. (författare)
- Infineon Technologies AG
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- Vassilev, Vessen, 1969 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Li, Y. (författare)
- Telefonaktiebolaget L M Ericsson,Ericsson
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- Oberhammer, Joachim (författare)
- KTH,Mikro- och nanosystemteknik,Kungliga Tekniska Högskolan (KTH),Royal Institute of Technology (KTH)
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- Zirath, Herbert, 1955 (författare)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- Institute of Electrical and Electronics Engineers (IEEE), 2017
- 2017
- Engelska.
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Ingår i: 2017 IEEE MTT-S International Microwave Symposium (IMS). - : Institute of Electrical and Electronics Engineers (IEEE). - 0149-645X. - 9781509063604 ; , s. 510-512
- Relaterad länk:
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http://publications.... (primary) (free)
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https://urn.kb.se/re...
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https://doi.org/10.1...
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https://research.cha...
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Abstract
Ämnesord
Stäng
- This paper presents a novel D-band interconnect implemented in a low-cost embedded Wafer Level Ball Grid Array (eWLB) commercial process. The non-galvanic transition is realized through a slot antenna directly radiating to a standard air filled waveguide. The interconnect achieves low insertion loss and relatively wide bandwidth. The measured average insertion loss is 3 dB across a bandwidth of 22% covering the frequency range 110138 GHz. The measured average return loss is -10 dB across the same frequency range. Adopting the low-cost eWLB process and standard waveguides makes the transition an attractive solution for interconnects beyond 100 GHz. This solution enables mm-wave system on chip (SoC) to be manufactured and assembled in high volumes cost effectively. To the authors' knowledge, this is first attempt to fabricate a packaging solution beyond 100 GHz using eWLB technology.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Nyckelord
- D-band
- EWLB
- Interconnects
- Millimeter waves
- THz
- Waveguide transition
Publikations- och innehållstyp
- ref (ämneskategori)
- kon (ämneskategori)
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