| 1. |
- Raugi, Fabien, et al.
(författare)
-
Flow Behaviour of Anisotropic Conductive Adhesive Film during COG Bonding Process in Flat Panel Display Assembly
- 2006
-
Ingår i: 1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006. - 1424405521 ; 2, s. 828-833
-
Konferensbidrag (refereegranskat)abstract
- Anisotropic conductive adhesives have emerged as an important joining technology in a number of significant application areas, such as fine pitched driver IC for flat panel display assembly and smart cards. In the past research work in this field, it has been shown that the pressure distribution and adhesive compression flow predicted using the Newtonian and non-Newtonian FV models both agree closely with those from the previously developed analytical model. This gives confidence in the FV modelling approach and therefore the results predicted more complex situations which the analytical model cannot address. These results further confirm that a more sophisticated modelling approach is required in order to allow a full understanding about the effects of the assembly process on its final properties when the adhesive flows. An analytical model has been proposed in this paper which takes into account more complex bump geometry and can be used to predict the velocity and pressure drop distribution through the entire chip during the COG bonding process. The analytical solution is followed by the finite element modelling, which agrees well with the analytically predicted solution.
|
|
| 2. |
- Wang, Teng, 1983, et al.
(författare)
-
Development and Characterization of Microcoolers using Carbon Nanotubes
- 2006
-
Ingår i: Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006). - 1424405521 ; 2, s. 881-885
-
Konferensbidrag (refereegranskat)abstract
- The continuously increasing integration and packaging density of microelectronic systems requires high-performance cooling technologies, among which the microchannel cooler is considered as a good approach. This work aims to develop a microchannel cooler with vertically aligned carbon nanotubes as the fins. Carbon nanotubes have unusually high thermal conductivity along with the possibility of small-scale formatting and wafer-level integration with chips, thus they provide a promising solution to implement microchannel coolers. By using photolithography, chemical vapor deposition, and adhesive bonding techniques, microcoolers containing carbon nanotube fins of different sizes and spacings are fabricated and then tested. They are also compared to a cooler with common silicon fins, as well as one with no fins. The experimental results reveal good heat removal capability of microcoolers using carbon nanotubes. The measurement result of the CNT cooler is about 10-15% better than the silicon cooler.
|
|
| 3. |
- Zheng, Li-Rong, et al.
(författare)
-
On-chip versus off-chip passives in radio and mixed-signal system-on-package design
- 2006
-
Ingår i: ESTC 2006 - 1st Electronics Systemintegration Technology Conference. - New York : IEEE. - 1424405521 - 9781424405527 ; , s. 221-232
-
Konferensbidrag (refereegranskat)abstract
- Optimal total solution for new radio architecture and implementation requires accurate trade-offs for off-chip versus off-chip passives. In this paper, a complete and systematic design methodology for RF blocks in SoP (system-on-package) versus SoC (system-on-chip) is presented. This methodology explores trade-offs between Performance and cost when different on-chip or off-chip passives are used. For a better presentation, the method and design techniques are demonstrated through four multi-band/multi-standard radio design examples with various technologies and different circuit topologies. Our study reveals that, in order to obtain cost benefits in RF-SoPs, small RF chips should be merged as larger chips and the integration density of each RF chip should be high enough. Our study also indicates that in a complex chip like a multi-band radio, moving passives off chip could achieve further cost savings and significant performance improvements. These are general conclusions but, our method offers a detailed analysis which can give quantitative measurements of cost savings and performance improvements in off-chip versus off-chip passives in RF SoP design.
|
|
