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- Antelius, Mikael, et al.
(författare)
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An apodized SOI waveguide-to-fiber surface grating coupler for single lithography silicon photonics
- 2011
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Ingår i: Optics Express. - 1094-4087. ; 19:4, s. 3592-3598
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Tidskriftsartikel (refereegranskat)abstract
- We present the design, fabrication, and characterization of a grating for coupling between a single mode silica fiber and the TE mode in a silicon photonic waveguide on a silicon on insulator (SOI) substrate. The grating is etched completely through the silicon device layer, thus permitting the fabrication of through-etched surface coupled silicon nanophotonic circuits in a single lithography step. Furthermore, the grating is apodized to match the diffracted wave to the mode profile of the fiber. We experimentally demonstrate a coupling efficiency of 35% with a 1 dB bandwidth of 47 nm at 1536 nm on a standard SOI substrate. Furthermore, we show by simulation that with an optimized buried oxide thickness, a coupling efficiency of 72% and a 1 dB bandwidth of 38 nm at 1550 nm is achievable. This is, to our knowledge, the highest simulated coupling efficiency for single-etch TE-mode grating couplers. In particular, simulations show that apodizing a conventional periodic through-etched grating decreases the back-reflection into the waveguide from 21% to 0.1%.
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- Antelius, Mikael, et al.
(författare)
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Hermetic integration of liquids in MEMS by room temperature, high-speed plugging of liquid-filled cavities at wafer level
- 2011
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Ingår i: Proceedings IEEE International Conference on Micro Electro Mechanical Systems (MEMS). - : IEEE. ; , s. 356-359
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- This paper reports a novel room temperature hermetic liquid sealing process based on wire bonded "plugs" over the access ports of liquid-filled cavities. The method enables liquids to be integrated already at the fabrication stage. Test vehicles were manufactured and used to investigate the mechanical and hermetic properties of the seals. A helium leak rate of better than 1E-10 mbarL/s was measured on the successfully sealed structures. The bond strength of the "plugs" were similar to standard wire bonds on flat surfaces.
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- Antelius, Mikael, et al.
(författare)
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Hermetic integration of liquids using high-speed stud bump bonding for cavity sealing at the wafer level
- 2012
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Ingår i: Journal of Micromechanics and Microengineering. - : IOP Publishing. - 0960-1317 .- 1361-6439. ; 22:4, s. 045021-
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Tidskriftsartikel (refereegranskat)abstract
- This paper reports a novel room-temperature hermetic liquid sealing process where the access ports of liquid-filled cavities are sealed with wire-bonded stud bumps. This process enables liquids to be integrated at the fabrication stage. Evaluation cavities were manufactured and used to investigate the mechanical and hermetic properties of the seals. Measurements on the successfully sealed structures show a helium leak rate of better than 10 (10) mbarL s (1), in addition to a zero liquid loss over two months during storage near boiling temperature. The bond strength of the plugs was similar to standard wire bonds on flat surfaces.
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- Antelius, Mikael, et al.
(författare)
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Room-temperature wafer-level vacuum sealing by compression of high-speed wire bonded gold bumps
- 2011
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Ingår i: Proceedings IEEE International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers). - : IEEE. ; , s. 1360-1363
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- This paper reports experimental results of a novel room temperature vacuum sealing process based on compressing wire bonded gold “bumps”, causing a material flow into the access ports of vacuum-cavities. The leak rate out of manufactured cavities was measured over 5 days and evaluated to less than the detection limit, 6×10-12 mbarL/s, per sealed port. The cavities have been sealed at a vacuum level below 10 mbar. The method enables sealing of vacuum cavities at room temperature using standard commercial tools and processes.
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- Antelius, Mikael, et al.
(författare)
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Small footprint wafer-level vacuum packaging using compressible gold sealing rings
- 2011
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Ingår i: Journal of Micromechanics and Microengineering. - : IOP Publishing. - 0960-1317 .- 1361-6439. ; 21:8, s. 085011-
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Tidskriftsartikel (refereegranskat)abstract
- A novel low-temperature wafer-level vacuum packaging process is presented. The process uses plastically deformed gold rings as sealing structures in combination with flux-free soldering to provide the bond force for a sealing wafer. This process enables the separation of the sealing and the bonding functions both spatially on the wafer and temporally in different process steps, which results in reduced areas for the sealing rings and prevents outgassing from the solder process in the cavity. This enables space savings and yields improvements. We show the experimental result of the hermetic sealing. The leak rate into the packages is determined, by measuring the package lid deformation over 10 months, to be lower than 3.5 x 10(-13) mbar l s(-1), which is suitable for most MEMS packages. The pressure inside the produced packages is measured to be lower than 10 mbar.
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- Antelius, Mikael, et al.
(författare)
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Wafer-Level Vacuum Sealing by Coining of Wire Bonded Gold Bumps
- 2013
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Ingår i: Journal of microelectromechanical systems. - 1057-7157 .- 1941-0158. ; 22:6, s. 1347-1353
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Tidskriftsartikel (refereegranskat)abstract
- This paper reports on the investigation of a novel room-temperature vacuum sealing method based on compressing wire bonded gold bumps which are placed to partially overlap the access ports into the cavity. The bump compression, which is done under vacuum, causes a material flow into the access ports, thereby hermetically sealing a vacuum inside the cavities. The sealed cavity pressure was measured by residual gas analysis to 8x10(-4) mbar two weeks after sealing. The residual gas content was found to be mainly argon, which indicates the source as outgassing inside the cavity and no measurable external leak. The seals are found to be mechanically robust and easily implemented by the use of standard commercial tools and processes.
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- Antelius, Mikael
(författare)
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Wafer-scale Vacuum and Liquid Packaging Concepts for an Optical Thin-film Gas Sensor
- 2013
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Doktorsavhandling (övrigt vetenskapligt/konstnärligt)abstract
- This thesis treats the development of packaging and integration methods for the cost-efficient encapsulation and packaging of microelectromechanical (MEMS) devices. The packaging of MEMS devices is often more costly than the device itself, partly because the packaging can be crucial for the performance of the device. For devices which contain liquids or needs to be enclosed in a vacuum, the packaging can account for up to 80% of the total cost of the device.The first part of this thesis presents the integration scheme for an optical dye thin film NO2-gas sensor, designed using cost-efficient implementations of wafer-scale methods. This work includes design and fabrication of photonic subcomponents in addition to the main effort of integration and packaging of the dye-film. A specific proof of concept target was for NO2 monitoring in a car tunnel.The second part of this thesis deals with the wafer-scale packaging methods developed for the sensing device. The developed packaging method, based on low-temperature plastic deformation of gold sealing structures, is further demonstrated as a generic method for other hermetic liquid and vacuum packaging applications. In the developed packaging methods, the mechanically squeezed gold sealing material is both electroplated microstruc- tures and wire bonded stud bumps. The electroplated rings act like a more hermetic version of rubber sealing rings while compressed in conjunction with a cavity forming wafer bonding process. The stud bump sealing processes is on the other hand applied on completed cavities with narrow access ports, to seal either a vacuum or liquid inside the cavities at room temperature. Additionally, the resulting hermeticity of primarily the vacuum sealing methods is thoroughly investigated.Two of the sealing methods presented require permanent mechanical fixation in order to complete the packaging process. Two solutions to this problem are presented in this thesis. First, a more traditional wafer bonding method using tin-soldering is demonstrated. Second, a novel full-wafer epoxy underfill-process using a microfluidic distribution network is demonstrated using a room temperature process.
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