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Search: WFRF:(Paskov Plamen) > (2020-2024)

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1.
  • Armakavicius, Nerijus, 1989-, et al. (author)
  • Electron effective mass in GaN revisited: New insights from terahertz and mid-infrared optical Hall effect
  • 2024
  • In: APL Materials. - : AIP Publishing. - 2166-532X. ; 12:2
  • Journal article (peer-reviewed)abstract
    • Electron effective mass is a fundamental material parameter defining the free charge carrier transport properties, but it is very challenging to be experimentally determined at high temperatures relevant to device operation. In this work, we obtain the electron effective mass parameters in a Si-doped GaN bulk substrate and epitaxial layers from terahertz (THz) and mid-infrared (MIR) optical Hall effect (OHE) measurements in the temperature range of 38-340 K. The OHE data are analyzed using the well-accepted Drude model to account for the free charge carrier contributions. A strong temperature dependence of the electron effective mass parameter in both bulk and epitaxial GaN with values ranging from (0.18 +/- 0.02) m(0) to (0.34 +/- 0.01) m(0) at a low temperature (38 K) and room temperature, respectively, is obtained from the THz OHE analysis. The observed effective mass enhancement with temperature is evaluated and discussed in view of conduction band nonparabolicity, polaron effect, strain, and deviations from the classical Drude behavior. On the other hand, the electron effective mass parameter determined by MIR OHE is found to be temperature independent with a value of (0.200 +/- 0.002) m(0). A possible explanation for the different findings from THz OHE and MIR OHE is proposed. (c) 2024 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/)
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2.
  • Delgado Carrascon, Rosalia, 1987- (author)
  • Epitaxial strategies for defect reduction in GaN for vertical power devices
  • 2022
  • Licentiate thesis (other academic/artistic)abstract
    • Group-III nitride materials, gallium nitride (GaN), aluminum nitride (AlN) and indium nitride (InN) have direct band gaps with band gap energies ranging from the infrared (InN) to the ultraviolet (GaN) and to the deep ultraviolet (AlN) wavelengths and covering the entire spectral range from 0.7 eV to 6.2 eV upon alloying. The invention of the GaN-based blue LEDs, for which the Nobel prize in Physics was awarded in 2014, has opened up avenues for exploration of IIINitride material and device technologies and has inspired generations of researchers in the semiconductor field. Group-III nitrides have also been demonstrated to be among the most promising semiconductors for next generation of efficient high-power, high-temperature and high-frequency electronic devices.The need to build a sustainable and efficient energy system motivates the development of vertical GaN transistors and diodes for applications with power ratings of 50-150 kW, e.g., in electric vehicles and industrial inverters. The key is to grow GaN layers with low concentration of defects (impurities and dislocations), which enables an expansion in both voltage and current ratings and reduction of cost. Despite intense investigations and impressive advances in the field, defects are still a major problem hindering exploiting the full potential of GaN in power electronics. This Licentiate thesis focuses on the development of two different epitaxial approaches in MOCVD for reducing dislocation densities in GaN with controlled doping for power device applications: i) growth of planar GaN layers trough NWs reformation, which can be further exploited as templates for a subsequent growth of thick drift layers and ii) homoepitaxial GaN growth. Special attention is put on understanding homoepitaxial growth under different nucleation schemes and thermal stability of GaN. We have established conditions in homoepitaxy to deliver state-of-the-art GaN material with low impurity levels combined with a reasonable growth rate suitable for growth of thick drift layers.The results are summarized in two papers: In Paper I we investigate GaN layers with different thicknesses on reformed GaN NW templates and highlight this approach as an alternative to the expensive GaN HVPE substrates. The sapphire used as a substrate limits to some extent the reduction of threading dislocations, however, the resulting GaN material presents smooth surfaces and thermal conductivity close to the bulk value, which suggests the potential of this approach to be integrated in GaN development as an active material for power devices on various substrates. In Paper II extensive study of homoepitaxial GaN growth by hot-wall MOCVD is presented together with results on the thermal stability of GaN under typical conditions used in our growth reactor. Understanding the evolution of GaN surface under different gas compositions and temperatures allows us to predict optimum homoepitaxial conditions. Analysis in the framework of Ga supersaturation of epilayers simultaneously grown on GaN templates and on GaN HVPE substrates reveals that residual strain and screw dislocation densities affect GaN nucleation and growth and lead to distinctively different morphologies on GaN templates and native substrates, respectively. The established comprehensive picture provides guidance for designing strategies for growth conditions optimization in homoepitaxy. We demonstrate homoepitaxial GaN-on-GaN grown under optimum growth conditions with state-of-the-art smooth surface with an rms value of 0.021 nm and an average TDD of 1.4·106 cm-2 which provide good basis for augmenting power device structures.Future work will be focused on GaN NWs reformation on different substrates, p- and n-type doping of homoepitaxial GaN with impurity control and the fabrication of pn power diode device structures for further processing and assessment by C3NiT partners.
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3.
  • Delgado Carrascon, Rosalia, 1987-, et al. (author)
  • Hot-Wall MOCVD for High-Quality Homoepitaxy of GaN : Understanding Nucleation and Design of Growth Strategies
  • 2022
  • In: Crystal Growth & Design. - : American Chemical Society (ACS). - 1528-7483 .- 1528-7505. ; 22:12, s. 7021-7030
  • Journal article (peer-reviewed)abstract
    • Thick GaN layers with a low concentration of defects are the key to enable next-generation vertical power electronic devices. Here, we explore hot-wall metalorganic chemical vapor deposition (MOCVD) for the development of GaN homoepitaxy. We propose a new approach to grow high quality homoepitaxial GaN in N2-rich carrier gas and at a higher supersaturation as compared to heteroepitaxy. We develop a low temperature GaN as an optimum nucleation scheme based on the evolution and thermal stability of the GaN surface under different gas compositions and temperatures. Analysis in the framework of nucleation theory of homoepitaxial layers simultaneously grown on GaN templates on SiC and on hydride vapor phase epitaxy GaN substrates is presented. We show that residual strain and screw dislocation densities affect GaN nucleation and subsequent growth leading to distinctively different morphologies of GaN homoepitaxial layers grown on GaN templates and native substrates, respectively. The established comprehensive picture provides a guidance for designing strategies for growth conditions optimization in GaN homoepitaxy. GaN with atomically flat and smooth epilayer surfaces with a root-mean-square roughness value as low as 0.049 nm and low background carbon concentration of 5.3 x 1015 cm-3 has been achieved. It is also shown that there is no generation of additional dislocations during homoepitaxial growth. Thus, our results demonstrate the potential of the hot-wall MOCVD technique to deliver high-quality GaN material for vertical power devices.
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4.
  • Delgado Carrascon, Rosalia, et al. (author)
  • Optimization of GaN Nanowires Reformation Process by Metalorganic Chemical Vapor Deposition for Device-Quality GaN Templates
  • 2020
  • In: Physica Status Solidi (B) Basic Research. - : Wiley. - 0370-1972 .- 1521-3951. ; 257:4
  • Journal article (peer-reviewed)abstract
    • Herein, the potential of reformed GaN nanowires (NWs) fabricated by metalorganic chemical vapor deposition (MOCVD) for device-quality low-defect density templates and low-cost alternative to bulk GaN substrates is demonstrated. The effects of epilayer thickness and NW reformation conditions on the crystalline quality and thermal conductivity of the subsequent GaN epilayers are investigated. Smooth surfaces with atomically step-like morphologies with no spirals are achieved for GaN epilayers on the reformed NW templates, indicating step-flow growth mode. It is further found that annealing of the NWs at a temperature of 1030 °C in the presence of NH3 and H2, followed by a coalescence done at the same temperature under planar growth conditions, leads to the most efficient screw dislocation density reduction by nearly an order of magnitude. At these optimized conditions, the growth takes place in a layer-by-layer fashion, producing a smooth surface with a root mean square (RMS) roughness of 0.12 nm. The highest thermal conductivity of k = 206 W m−1 K−1, approaching the respective value of bulk GaN, is obtained for the optimized 2 μm-thick GaN layer. The thermal conductivity results are further discussed in terms of the phonon-dislocation and the phonon-boundary scattering.
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5.
  • Gogova, Daniela, et al. (author)
  • Epitaxial growth of β -Ga 2 O 3 by hot-wall MOCVD
  • 2022
  • In: AIP Advances. - : AIP Publishing. - 2158-3226. ; 12:5, s. 055022-055022
  • Journal article (peer-reviewed)abstract
    • The hot-wall metalorganic chemical vapor deposition (MOCVD) concept, previously shown to enable superior material quality and highperformance devices based on wide bandgap semiconductors, such as Ga(Al)N and SiC, has been applied to the epitaxial growth ofβ-Ga2O3. Epitaxial β-Ga2O3 layers at high growth rates (above 1 μm/h), at low reagent flows, and at reduced growth temperatures(740 ○C) are demonstrated. A high crystalline quality epitaxial material on a c-plane sapphire substrate is attained as corroborated by a combination of x-ray diffraction, high-resolution scanning transmission electron microscopy, and spectroscopic ellipsometry measurements. Thehot-wall MOCVD process is transferred to homoepitaxy, and single-crystalline homoepitaxial β-Ga2O3 layers are demonstrated with a 201 ¯rocking curve width of 118 arc sec, which is comparable to those of the edge-defined film-fed grown (201) ¯ β-Ga2O3 substrates, indicative ofsimilar dislocation densities for epilayers and substrates. Hence, hot-wall MOCVD is proposed as a prospective growth method to be furtherexplored for the fabrication of β-Ga2O3
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6.
  • Gogova, Daniela, 1967-, et al. (author)
  • Epitaxial growth of β-Ga2O3 by hot-wall MOCVD
  • 2022
  • In: AIP Advances. - : AIP Publishing. - 2158-3226. ; 12:5
  • Journal article (peer-reviewed)abstract
    • The hot-wall metalorganic chemical vapor deposition (MOCVD) concept, previously shown to enable superior material quality and high performance devices based on wide bandgap semiconductors, such as Ga(Al)N and SiC, has been applied to the epitaxial growth of beta-Ga2O3. Epitaxial beta-Ga2O3 layers at high growth rates (above 1 mu m/h), at low reagent flows, and at reduced growth temperatures (740 degrees C) are demonstrated. A high crystalline quality epitaxial material on a c-plane sapphire substrate is attained as corroborated by a combination of x-ray diffraction, high-resolution scanning transmission electron microscopy, and spectroscopic ellipsometry measurements. The hot-wall MOCVD process is transferred to homoepitaxy, and single-crystalline homoepitaxial beta-Ga2O3 layers are demonstrated with a 201 rocking curve width of 118 arc sec, which is comparable to those of the edge-defined film-fed grown (201) beta-Ga2O3 substrates, indicative of similar dislocation densities for epilayers and substrates. Hence, hot-wall MOCVD is proposed as a prospective growth method to be further explored for the fabrication of beta-Ga2O3.
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7.
  • Knight, Sean Robert, et al. (author)
  • Room temperature two-dimensional electron gas scattering time, effective mass, and mobility parameters in AlxGa1−xN/GaN heterostructures (0.07 ≤ x ≤ 0.42)
  • 2023
  • In: Journal of Applied Physics. - : American Institute of Physics Inc.. - 0021-8979 .- 1089-7550. ; 134:18
  • Journal article (peer-reviewed)abstract
    • Al xGa 1−xN/GaN high-electron-mobility transistor (HEMT) structures are key components in electronic devices operating at gigahertz or higher frequencies. In order to optimize such HEMT structures, understanding their electronic response at high frequencies and room temperature is required. Here, we present a study of the room temperature free charge carrier properties of the two-dimensional electron gas (2DEG) in HEMT structures with varying Al content in the Al xGa 1−xN barrier layers between x=0.07 and x=0.42⁠. We discuss and compare 2DEG sheet density, mobility, effective mass, sheet resistance, and scattering times, which are determined by theoretical calculations, contactless Hall effect, capacitance-voltage, Eddy current, and cavity-enhanced terahertz optical Hall effect (THz-OHE) measurements using a low-field permanent magnet (0.6 T). From our THz-OHE results, we observe that the measured mobility reduction from x=0.13 to x=0.42 is driven by the decrease in 2DEG scattering time, and not the change in effective mass. For x<0.42⁠, the 2DEG effective mass is found to be larger than for electrons in bulk GaN, which in turn, contributes to a decrease in the principally achievable mobility. From our theoretical calculations, we find that values close to 0.3 m0 can be explained by the combined effects of conduction band nonparabolicity, polarons, and hybridization of the electron wavefunction through penetration into the barrier layer.
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8.
  • Kuhne, Philipp, et al. (author)
  • Enhancement of 2DEG effective mass in AlN/Al0.78Ga0.22N high electron mobility transistor structure determined by THz optical Hall effect
  • 2022
  • In: Applied Physics Letters. - : AIP Publishing. - 0003-6951 .- 1077-3118. ; 120:25
  • Journal article (peer-reviewed)abstract
    • We report on the free charge carrier properties of a two-dimensional electron gas (2DEG) in an AlN/AlxGa1-xN high electron mobility transistor structure with a high aluminum content (x = 0.78). The 2DEG sheet density N s = ( 7.3 +/- 0.7 ) x 10 12 cm(-2), sheet mobility mu s = ( 270 +/- 40 ) cm(2)/(Vs), sheet resistance R- s = ( 3200 +/- 500 ) omega/ ?, and effective mass m( eff) = ( 0.63 +/- 0.04 ) m( 0) at low temperatures ( T = 5 K ) are determined by terahertz (THz) optical Hall effect measurements. The experimental 2DEG mobility in the channel is found within the expected range, and the sheet carrier density is in good agreement with self-consistent Poisson-Schrodinger calculations. However, a significant increase in the effective mass of 2DEG electrons at low temperatures is found in comparison with the respective value in bulk Al0.78Ga22N ( m( eff) = 0.334 m( 0)). Possible mechanisms for the enhanced 2DEG effective mass parameter are discussed and quantified using self-consistent Poisson-Schrodinger calculations .Published under an exclusive license by AIP Publishing.
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9.
  • Papamichail, Alexis, et al. (author)
  • Mg-doping and free-hole properties of hot-wall MOCVD GaN
  • 2022
  • In: Journal of Applied Physics. - : AIP Publishing. - 0021-8979 .- 1089-7550. ; 131:18
  • Journal article (peer-reviewed)abstract
    • The hot-wall metal-organic chemical vapor deposition (MOCVD), previously shown to enable superior III-nitride material quality and high performance devices, has been explored for Mg doping of GaN. We have investigated the Mg incorporation in a wide doping range (2.45 × 10 18 cm-3 up to 1.10 × 10 20 cm-3) and demonstrate GaN:Mg with low background impurity concentrations under optimized growth conditions. Dopant and impurity levels are discussed in view of Ga supersaturation, which provides a unified concept to explain the complexity of growth conditions impact on Mg acceptor incorporation and compensation. The results are analyzed in relation to the extended defects, revealed by scanning transmission electron microscopy, x-ray diffraction, and surface morphology, and in correlation with the electrical properties obtained by Hall effect and capacitance-voltage (C-V) measurements. This allows to establish a comprehensive picture of GaN:Mg growth by hot-wall MOCVD providing guidance for growth parameters optimization depending on the targeted application. We show that substantially lower H concentration as compared to Mg acceptors can be achieved in GaN:Mg without any in situ or post-growth annealing resulting in p-type conductivity in as-grown material. State-of-the-art p-GaN layers with a low resistivity and a high free-hole density (0.77 ω cm and 8.4 × 10 17 cm - 3, respectively) are obtained after post-growth annealing demonstrating the viability of hot-wall MOCVD for growth of power electronic device structures.
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10.
  • Stanishev, Vallery, et al. (author)
  • Low Al-content n-type AlxGa1−xN layers with a high-electron-mobility grown by hot-wall metalorganic chemical vapor deposition
  • 2023
  • In: Vacuum. - : PERGAMON-ELSEVIER SCIENCE LTD. - 0042-207X .- 1879-2715. ; 217
  • Journal article (peer-reviewed)abstract
    • In this work, we demonstrate the capability of the hot-wall metalorganic chemical vapor deposition to deliver high-quality n-AlxGa1−xN (x = 0 – 0.12, [Si] = 1×1017 cm−3) epitaxial layers on 4H-SiC(0001). All layers are crack-free, with a very small root mean square roughness (0.13 – 0.25 nm), homogeneous distribution of Al over film thickness and a very low unintentional incorporation of oxygen at the detection limit of 5×1015 cm−3 and carbon of 2×1016 cm−3. Edge type dislocations in the layers gradually increase with increasing Al content while screw dislocations only raise for x above 0.077. The room temperature electron mobility of the n-AlxGa1−xN remain in the range of 400 – 470 cm2/(V.s) for Al contents between 0.05 and 0.077 resulting in comparable or higher Baliga figure of merit with respect to GaN, and hence demonstrating their suitability for implementation as drift layers in power device applications. Further increase in Al content is found to result in significant deterioration of the electrical properties.
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  • Result 1-10 of 24
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