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Study of the effect...
Study of the effect of pulse plating parameters on the electrodeposition of NiP and NiP/SiC coatings and their microhardness values
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- Ahmadkhaniha, Donya (author)
- Jönköping University,JTH, Material och tillverkning
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- Tsongas, K. (author)
- Centre for Research and Technology–Hellas, Institute for Bio-Economy and Agri-Technology, Thessaloniki, Greece
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- Tzetzis, D. (author)
- Centre for Research and Technology–Hellas, Institute for Bio-Economy and Agri-Technology, Thessaloniki, Greece
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- Zanella, Caterina (author)
- Jönköping University,JTH, Material och tillverkning
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(creator_code:org_t)
- 2021-01-19
- 2021
- English.
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In: Transactions of the Institute of Metal Finishing. - : Taylor & Francis. - 0020-2967 .- 1745-9192. ; 99:1, s. 29-37
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Abstract
Subject headings
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- This study is focused on finding optimised conditions for electrodeposition of NiP and NiP/SiC coatings, which enhance the coatings' microhardness. Both the effect of particles and the effect of heat treatment at 400°C for 1 h on the microhardness of the coating were studied. The effects of pulse electrodeposition parameters including duty cycle, frequency, and peak current density on the composition of NiP and NiP/SiC composite coatings were examined, and the results were compared with those from direct current plating. Pulse plating increased the current efficiency of NiP deposition while decreasing the phosphorus content of these coatings in comparison to direct plating, resulting in higher microhardness values. It was also shown that wt.%P in NiP coating depends not only on peak current density but also on bath charge of pulse plating. Pulse plating parameters (duty cycle and frequency) and the low incorporation of SiC particles did not affect microstructure or the microhardness of the coatings, while heat treatment was the main factor that increased microhardness.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Materialteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering (hsv//eng)
Keyword
- current efficiency
- heat treatment
- microhardness
- microstructure
- NiP/SiC
- Pulse electrodeposition
- Composite coatings
- Electrodeposition
- Electrodes
- Nickel compounds
- Nickel-Phosphorus
- Plating
- Silicon
- Silicon carbide
- Silicon compounds
- Direct current plating
- Effect of heat treatments
- Effect of pulse
- Optimised conditions
- Peak current density
- Phosphorus contents
- Phosphorus compounds
Publication and Content Type
- ref (subject category)
- art (subject category)
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