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CoBRA : Low cost compensation of TSV failures in 3D-NoC
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Salamat, R. (författare)
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- Ebrahimi, Masoumeh (författare)
- KTH,Elektronik och inbyggda system
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Bagherzadeh, N. (författare)
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Verbeek, F. (författare)
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(creator_code:org_t)
- Institute of Electrical and Electronics Engineers Inc. 2016
- 2016
- Engelska.
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Ingår i: 2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, DFT 2016. - : Institute of Electrical and Electronics Engineers Inc.. - 9781509036233 ; , s. 115-120
- Relaterad länk:
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https://urn.kb.se/re...
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https://doi.org/10.1...
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Abstract
Ämnesord
Stäng
- 3D-NoC has emerged to provide fast and power efficient connection between the layers of 2D-NoCs using Through-Silicon-Vias (TSV). Thermal stress, warpage, impurities and misalignment during the manufacturing process make these expensive TSVs vulnerable to faults. Chips with faulty TSVs should be either discarded or utilized by providing a proper fault-tolerant method. In this paper, we target designing a reconfigurable fault-tolerant routing algorithm capable of tolerating fabrication-time or run-time TSV failures. The proposed algorithm ensures a fault-free communication between any two nodes in the presence of TSV failures. Experimental results show that the proposed fault-tolerant routing algorithm provides 100% reliability as long as there is one healthy TSV in the eastmost or westmost column. The reliability of the counterpart algorithm, the Elevator-first routing algorithm, drops to 75% and 45% in presence of one and two faulty TSVs, respectively.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Inbäddad systemteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Embedded Systems (hsv//eng)
Nyckelord
- Defects
- Electronics packaging
- Fault tolerance
- Nanotechnology
- Network-on-chip
- VLSI circuits
- Fabrication time
- Fault-tolerant method
- Fault-tolerant routing algorithm
- Free communications
- Low cost compensation
- Manufacturing process
- Power efficient
- Through silicon vias
- Three dimensional integrated circuits
Publikations- och innehållstyp
- ref (ämneskategori)
- kon (ämneskategori)
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