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Area Selective Depo...
Area Selective Deposition of Metals from the Electrical Resistivity of the Substrate
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- Nadhom, Hama, 1986- (author)
- Linköpings universitet,Kemi,Tekniska fakulteten
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- Boyd, Robert, 1972- (author)
- Linköpings universitet,Plasma och ytbeläggningsfysik,Tekniska fakulteten
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- Rouf, Polla, 1993- (author)
- Linköpings universitet,Kemi,Tekniska fakulteten
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- Lundin, Daniel, 1980- (author)
- Linköpings universitet,Plasma och ytbeläggningsfysik,Tekniska fakulteten
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- Pedersen, Henrik, 1981- (author)
- Linköpings universitet,Kemi,Tekniska fakulteten
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(creator_code:org_t)
- 2021-04-22
- 2021
- English.
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In: The Journal of Physical Chemistry Letters. - : American Chemical Society (ACS). - 1948-7185. ; 12:17, s. 4130-4133
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https://liu.diva-por... (primary) (Raw object)
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https://urn.kb.se/re...
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Abstract
Subject headings
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- Area selective deposition (ASD) of films only on desired areas of the substrate opens for less complex fabrication of nanoscaled electronics. We show that a newly developed CVD method, where plasma electrons are used as the reducing agent in deposition of metallic thin films, is inherently area selective from the electrical resistivity of the substrate surface. When depositing iron with the new CVD method, no film is deposited on high-resistivity SiO2 surfaces whereas several hundred nanometers thick iron films are deposited on areas with low resistivity, obtained by adding a thin layer of silver on the SiO2 surface. On the basis of such a scheme, we show how to use the electric resistivity of the substrate surface as an extension of the ASD toolbox for metal-on-metal deposition.
Subject headings
- NATURVETENSKAP -- Kemi -- Oorganisk kemi (hsv//swe)
- NATURAL SCIENCES -- Chemical Sciences -- Inorganic Chemistry (hsv//eng)
Keyword
- Iron
- Thin films
- Deposition
- Plasma
- Chemical vapor deposition
Publication and Content Type
- ref (subject category)
- art (subject category)
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