Annealing studies of nanocomposite Ti-Si-C thin films with respect to phase stability and tribological performance

Rester, M. (author)

Neidhardt, Jörg, 1976- (author): Linköpings universitet,Tekniska högskolan,Tunnfilmsfysik

Eklund, Per, 1977- (author): Linköpings universitet,Tekniska högskolan,Tunnfilmsfysik

Emmerlich, Jens, 1974- (author): Linköpings universitet,Tekniska högskolan,Tunnfilmsfysik

Ljungcrantz, H. (author)

Hultman, Lars, 1960- (author): Linköpings universitet,Tekniska högskolan,Tunnfilmsfysik

Mitterer, C. (author)

(creator_code:org_t)

Elsevier BV, 2006
2006
English.
In: Materials Science & Engineering. - : Elsevier BV. - 0921-5093 .- 1873-4936. ; 429:1-2, s. 90-95

Related links:: https://urn.kb.se/re...; show more...; https://doi.org/10.1...; show less...

Abstract Subject headings

Nanocomposite Ti-Si-C thin films were deposited by dc magnetron sputtering from a Ti3SiC2 target onto Si(1 0 0) and high-speed steel substrates at 300 °C. The as-deposited films consisted of nanocrystalline (nc-) TiCx and amorphous (a-) SiCx, as determined by X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS). Annealing in vacuum up to 1450 °C resulted in improved crystallinity and a decreased volume fraction of the amorphous phase. Additionally, differential scanning calorimetry (DSC) was used to monitor heat flows connected to the respective reactions in the material, where a broad exothermic peak attributed to grain growth of crystalline TiCx appeared, while an exothermic reaction related to the formation of Ti3SiC2 was not detected. Tribological testing in a ball-on-disk setup was conducted at room temperature, 500 and 700 °C against an alumina counterpart. The room temperature measurement resulted in a coefficient of friction value of 0.8, at elevated temperatures the coefficient of friction decreased to 0.4. © 2006 Elsevier B.V. All rights reserved.

By the author/editor: Rester, M.; Neidhardt, Jörg, ...; Eklund, Per, 197 ...; Emmerlich, Jens, ...; Ljungcrantz, H.; Hultman, Lars, 1 ...; show more...; Mitterer, C.; show less...

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