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Thermal properties ...
Thermal properties of TIM using CNTs forest in electronics packaging
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- Zhang, Dongsheng (author)
- Shanghai University
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- Liu, Jiawen (author)
- Shanghai University
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- Liu, Johan, 1960 (author)
- Shanghai University
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- Sun, Shuangxi, 1986 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Huang, Shirong (author)
- Shanghai University
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- Bao, Jie (author)
- Shanghai University
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- Wang, N. (author)
- Shanghai University
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- Lu, Xiuzhen (author)
- Shanghai University
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(creator_code:org_t)
- 2016
- 2016
- English.
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In: 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016; Wuhan Optics Valley Kingdom Hotel Wuhan; China; 16 August 2016 through 19 August 2016. ; , s. 1355-1359
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Abstract
Subject headings
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- Thermal interface material (TIM) is applied to fill the air gaps of interfaces, which provides a path for interfacial heat transfer. Owing to the exceptional thermal properties of carbon nanotubes (CNT), TIMs based on CNTs have received much attention in recent years. In this study, heat dissipation performance of vertically aligned carbon nanotubes (VACNT) arrays as TIM in electronic packing was analyzed. Vertically aligned carbon nanotubes with length of 245?m and 763?m were synthesized on a silicon substrate by chemical vapor deposition respectively. Morphology of the vertically aligned carbon nanotubes was characterized by scanning electron microscope. The hotspot temperature of thermal test chip with vertically aligned carbon nanotubes were characterized by resistance temperature detector method and infrared imaging method.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Materialteknik -- Keramteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering -- Ceramics (hsv//eng)
- NATURVETENSKAP -- Kemi -- Materialkemi (hsv//swe)
- NATURAL SCIENCES -- Chemical Sciences -- Materials Chemistry (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Materialteknik -- Annan materialteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering -- Other Materials Engineering (hsv//eng)
Keyword
- resistance temperature detector
- hotspot
- VACNT
- dissipation
- thermal test chip
- heat
Publication and Content Type
- kon (subject category)
- ref (subject category)
To the university's database
- By the author/editor
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Zhang, Dongsheng
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Liu, Jiawen
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Liu, Johan, 1960
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Sun, Shuangxi, 1 ...
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Huang, Shirong
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Bao, Jie
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show more...
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Wang, N.
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Lu, Xiuzhen
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show less...
- About the subject
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- ENGINEERING AND TECHNOLOGY
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ENGINEERING AND ...
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and Materials Engine ...
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and Ceramics
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- NATURAL SCIENCES
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NATURAL SCIENCES
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and Chemical Science ...
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and Materials Chemis ...
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- ENGINEERING AND TECHNOLOGY
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ENGINEERING AND ...
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and Materials Engine ...
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and Other Materials ...
- Articles in the publication
- 2016 17th Intern ...
- By the university
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Chalmers University of Technology