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Characterterization of multi-scale nanosilver paste reinforced with SIC particles

Jiang, Ziwei (author)
Shanghai University
Sun, Yongqian (author)
Shanghai University
Zhang, Qiaoran (author)
Shanghai University
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Lv, Zhen (author)
Shanghai University
Wu, Yanpei (author)
Aerospace Science and Technology Corporation
Xi, Weijuan (author)
Aerospace Science and Technology Corporation
Zhou, Cheng (author)
Aerospace Science and Technology Corporation
Chen, S. (author)
Shanghai University
Zhang, Maomao (author)
Shanghai University
Liu, Johan, 1960 (author)
Shanghai University,Chalmers tekniska högskola,Chalmers University of Technology
Lu, Xiuzhen (author)
Shanghai University
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 (creator_code:org_t)
2020
2020
English.
In: China Semiconductor Technology International Conference 2020, CSTIC 2020.
  • Conference paper (peer-reviewed)
Abstract Subject headings
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  • Nanosilver paste with high operation temperature and low sintering temperature has attracted more and more attention for its promising application in high power devices. In this paper, the thermal properties of multi-scale nanosilver paste composed of nanometer and micrometer silver particles, and Ag-coated SiC particles were investigated. The thermal conductivity of multi-scale nanosilver paste increases with the increasing amount of SiC particles with Ag coating. The maximum value of Vickers hardness for multi-scale nanosilver paste with 0.5 wt.% Ag-coated SiC particles were 24.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Maskinteknik -- Tribologi (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Mechanical Engineering -- Tribology (hsv//eng)
TEKNIK OCH TEKNOLOGIER  -- Materialteknik -- Keramteknik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Materials Engineering -- Ceramics (hsv//eng)
TEKNIK OCH TEKNOLOGIER  -- Materialteknik -- Bearbetnings-, yt- och fogningsteknik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Materials Engineering -- Manufacturing, Surface and Joining Technology (hsv//eng)

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