Selectively anodised aluminium foils as an insulating layer for embedding electronic circuitry in a metal matrix via ultrasonic additive manufacturing

Bournias-Varotsis, A.Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, United Kingdom (author)

Funding: the Engineering and Physical Science Research Council (EPSRC) as part of the Centre for Innovative Manufacturing in Additive Manufacturing
Ultrasonic Additive Manufacturing (UAM) is a hybrid Additive Manufacturing (AM) process that involves layer-by-layer ultrasonic welding of metal foils and periodic machining to achieve the desired shape. Prior investigative research has demonstrated the potential of UAM for the embedding of electronic circuits inside a metal matrix. In this paper, a new approach for the fabrication of an insulating layer between an aluminium (Al) matrix and embedded electronic interconnections is presented. First, an Anodic Aluminium Oxide (AAO) layer is selectively grown onto the surface of Al foils prior to bonding. The pre-treated foils are then welded onto a UAM fabricated aluminium substrate. The bonding step can be repeated for the full encapsulation of the electronic interconnections or components. This ceramic AAO insulating layer provides several advantages over the alternative organic materials used in previous works.

Friel, R. J.,Dr,1982-Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, United Kingdom(Swepub:hh)rosfri (author)
Harris, R. A.Mechanical Engineering, University of Leeds, Leeds, United Kingdom (author)
Engstrom, D. S.Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, United Kingdom (author)
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, United KingdomMechanical Engineering, University of Leeds, Leeds, United Kingdom (creator_code:org_t)

In:Solid Freeform Fabrication 2016: Laboratory for Freeform Fabrication, s. 2260-2270

By the author/editor: Bournias-Varotsi ...; Friel, R. J., Dr ...; Harris, R. A.; Engstrom, D. S.

About the subject

ENGINEERING AND TECHNOLOGY: ENGINEERING AND ...; and Electrical Engin ...; and Embedded Systems

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