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- Belov, IljaJönköping University,JTH. Forskningsmiljö Material och tillverkning - Ytteknik,JTH. Forskningsområde Robusta inbyggda system,Rubust Electronics (author)
CFD aided reflow oven profiling for PCB preheating in a soldering process
- Article/chapterEnglish2007
Publisher, publication year, extent ...
- Piscataway, NJ.IEEE,2007
- printrdacarrier
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- LIBRIS-ID:oai:DiVA.org:hj-4603
- https://urn.kb.se/resolve?urn=urn:nbn:se:hj:diva-4603URI
- https://doi.org/10.1109/ESIME.2007.359951DOI
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- Language:English
- Summary in:English
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- Forskningsområdet Robusta inbyggda system bytte namn till Forskningsmiljö Material och tillverkning – Ytteknik 2011-01-01 Research area Robust Embedded Systems changed its name to Research area Materials and manufacturing - Surface technology 01-01-2011
- A CFD-aided reflow oven profile prediction algorithm has been developed and applied to modelling of preheating of a PCB with non-uniform distribution of component thermal mass in a forced air convection solder reflow oven. The iterative algorithm combines an analytic approach with CFD modelling. It requires an experimentally validated CFD model of the solder reflow oven and a CFD model of the PCB as main inputs. Results of computational experiments have been presented to reveal good agreement between predicted PCB profiles and corresponding CFD calculations. Application guidelines contained in the description of the algorithm will assist potential users both during the virtual prototyping phase of a PCB including designing for assembly and in the phase of reflow oven profiling.
Subject headings and genre
- TEKNIK OCH TEKNOLOGIER Materialteknik Bearbetnings-, yt- och fogningsteknik hsv//swe
- ENGINEERING AND TECHNOLOGY Materials Engineering Manufacturing, Surface and Joining Technology hsv//eng
- NATURVETENSKAP Matematik Beräkningsmatematik hsv//swe
- NATURAL SCIENCES Mathematics Computational Mathematics hsv//eng
Added entries (persons, corporate bodies, meetings, titles ...)
- Lindgren, MatsJönköping University,JTH. Forskningsmiljö Material och tillverkning - Ytteknik,JTH. Forskningsområde Robusta inbyggda system (author)
- Leisner, PeterJönköping University,JTH. Forskningsmiljö Material och tillverkning - Ytteknik,JTH. Forskningsområde Robusta inbyggda system,Robust Electronics(Swepub:hj)lepe (author)
- Bergner, Fredrik (author)
- Bornoff, Robin (author)
- Jönköping UniversityJTH. Forskningsmiljö Material och tillverkning - Ytteknik (creator_code:org_t)
Related titles
- In:Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-SystemsPiscataway, NJ. : IEEE, s. 535-542142441105X
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