Modeling of Temperature Distribution Induced by Thermo-Mechanical Deformation of High-Power AlInGaN LED Arrays

• Thermo-mechanical deformation, thermal resistance, and lateral temperature distribution were experimentally studied for a high-power AlGaInN LED chip-on-board array at three different input powers. A fullscale CFD model of the LED assembly was developed and correlated with the temperature and average thermal resistance measurements to enable prediction of the temperature distribution on the surface of a thermally deformed LED assembly. Application of the thermal resistance partitioning approach to thermal modeling of the deformed LED assemblies was discussed. It can be useful for design engineers for estimation of the temperature distribution across the deformed LED array, at the minimum number of temperature measurements required for model calibration.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Materialteknik -- Annan materialteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Materials Engineering -- Other Materials Engineering (hsv//eng)

Nyckelord

Aluminum compounds

Deformation

Gallium compounds

Indium compounds

Integrated circuits

Temperature distribution

Temperature measurement

CFD modeling

Design engineers

High power

LED assemblies

Model calibration

Thermal model

Thermal resistance measurement

Thermomechanical deformations

Light emitting diodes

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