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A Comparative study...
A Comparative study of the bonding energy in adhesive wafer bonding
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- Forsberg, Fredrik (författare)
- KTH,Mikro- och nanosystemteknik
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- Saharil, Farizah (författare)
- KTH,Mikro- och nanosystemteknik
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- Haraldsson, Tommy (författare)
- KTH,Mikro- och nanosystemteknik
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- Roxhed, Niclas (författare)
- KTH,Mikro- och nanosystemteknik
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- Stemme, Göran (författare)
- KTH,Mikro- och nanosystemteknik
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- van der Wijngaart, Wouter (författare)
- KTH,Mikro- och nanosystemteknik
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- Niklaus, Frank (författare)
- KTH,Mikro- och nanosystemteknik
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(creator_code:org_t)
- 2013-07-12
- 2013
- Engelska.
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Ingår i: Journal of Micromechanics and Microengineering. - : IOP Publishing. - 0960-1317 .- 1361-6439. ; 23:8, s. 1-7
- Relaterad länk:
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http://iopscience.io...
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https://kth.diva-por... (primary) (Raw object)
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http://kth.diva-port...
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https://urn.kb.se/re...
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https://doi.org/10.1...
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Abstract
Ämnesord
Stäng
- Adhesion energies are determined for three different polymers currently used in adhesive wafer bonding of silicon wafers. The adhesion energies of the polymer off-stoichiometry thiol-ene-epoxy OSTE+ and the nano-imprint resist mr-I 9150XP are determined. The results are compared to the adhesion energies of wafers bonded with benzocyclobutene, both with and without adhesion promoter. The adhesion energies of the bonds are studied by blister tests, consisting of delaminating silicon lids bonded to silicon dies with etched circular cavities, using compressed nitrogen gas. The critical pressure needed for delamination is converted into an estimate of the bond adhesion energy. The fabrication of test dies and the evaluation method are described in detail. The mean bond energies of OSTE+ were determined to be 2.1 and 20 J m(-2) depending on the choice of the epoxy used. A mean bond energy of 1.5 J m(-2) was measured for mr-I 9150XP.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Nanoteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Nano-technology (hsv//eng)
Nyckelord
- Microfluidic Devices
- SU-8
- Benzocyclobutene
- Level
- BCB
- wafer bonding
- heterogeneous integration
Publikations- och innehållstyp
- ref (ämneskategori)
- art (ämneskategori)
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