Blueprint and integration of vastly efficient 802.11A WLAN front-end

• Next generation wireless communications terminals will demand the use of advanced component integration processes and high density packaging technologies in order to reduce size and to increase performance. This paper presents high density multilayer interconnects and integrated passives used to design high performance prototype filter for 5GHz wireless LAN receiver realized on MCM-D substrate. The thin film implementation of Multichip Module technology is identified as a useful platform for the integration of GaAs MMIC and silicon device technologies for microwave applications where performance, size and weight are critical factors. The ability of the MCM-D technology to provide controlled impedance, microstrip structures and integrated thin film passive components with useful performance in the microwave frequency regime has now been demonstrated.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Telekommunikation (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Telecommunications (hsv//eng)

Keyword

Filter

Front-end

LNA

Microstrip

Multichip

Passives

Receiver

Blueprints

Multichip modules

Semiconducting gallium arsenide

Semiconducting silicon

Semiconductor devices

Signal receivers

Thin films

Wireless telecommunication systems

Integrated passives

Multilayer interconnects

Prototype filter

Local area networks

Publication and Content Type

ref (subject category)

art (subject category)