Investigation of pressure dependent thermal contact resistance between silver metallized SiC chip and DBC substrate

• Thermal contact resistances between a silver metallized SiC chip and a direct bonded copper (DBC) substrate have been measured in a heat transfer experiment. A novel experimental method to separate thermal contact resistances in multilayer heat transfer path has been demonstrated. The experimental results have been compared both with analytical calculations and with 3D computational fluid dynamics (CFD) simulation results. A simplified CFD model of the experimental setup has been validated. The results show significant pressure dependence of the thermal contact resistance but also a pressure independent part.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Maskinteknik -- Strömningsmekanik och akustik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Mechanical Engineering -- Fluid Mechanics and Acoustics (hsv//eng)

Keyword

DBC substrate

Heat transfer

Pressure dependence

SiC

Thermal contact resistance

Computational fluid dynamics

Contact resistance

Metallizing

Silicon carbide

Silver

Thermal conductivity of solids

Analytical calculation

Computational fluid dynamics simulations

Direct bonded coppers

Experimental methods

Pressure dependent

Heat resistance

Publication and Content Type

ref (subject category)

kon (subject category)