Corrosion Investigations of Ruthenium in Potassium Periodate Solutions Relevant for Chemical Mechanical Polishing

• Ruthenium is the most promising material for the barrier layer used for the sub 14 nm technology node in integrated circuits manufacturing. Potassium periodate (KIO4)-based slurry is used in the chemical mechanical planarization (CMP) process of the barrier layer. However, the electrochemical and corrosion properties of ruthenium have not been investigated in such slurry. In this paper, the electrochemical and corrosion behaviors of ruthenium in KIO4 solutions were investigated under static conditions but at different pH values by potentiodynamic polarization and electrochemical impedance spectroscopy measurements, combined with surface chemical analysis using auger electron spectroscopy. Moreover, to study wear enhanced corrosion during CMP, tribocorrosion experiments were carried out to monitor the current density changes during and after mechanical scratching. The results show that at pH 6, ruthenium forms a relatively thick and heterogeneous surface film composed of RuO2 center dot 2H(2)O/RuO3, showing a high corrosion resistance and it exhibits a quick repassivation after mechanical scratching. At pH 4, ruthenium shows a passivation behavior with formation of a uniform and conductive oxide like RuO2 center dot 2H(2)O. It should be noted that there is a possible formation of RuO4 toxic gas under this condition, which should be avoided in the actual production. However, at pH 11, ruthenium exhibits no considerable passivity and the corrosion proceeds uniformly.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Nyckelord

Ruthenium

chemical mechanical planarization (CMP)

potassium periodate

tribocorrosion

surface passivation

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