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Electrical characte...
Electrical characterization of titanium-based ohmic contacts to 4H-Silicon carbide for high-power and high-temperature operation
- Artikel/kapitelEngelska2002
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Nummerbeteckningar
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LIBRIS-ID:oai:DiVA.org:kth-21471
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https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-21471URI
Kompletterande språkuppgifter
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Språk:engelska
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Sammanfattning på:engelska
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Klassifikation
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Ämneskategori:ref swepub-contenttype
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Ämneskategori:art swepub-publicationtype
Anmärkningar
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QC 20100525
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We report on titanium-based ohmic contacts (titanium carbide. titanium tungsten, and titanium) on both highly doped epilayers (n(+) and p(+)) and Al-ion-implanted layers. The TiC contact layer was epitaxially grown on epilayers as well as an Al-ion-implanted layers of 4H-SiC by co-evaporation Ti and C-60 under an ultra-high vacuum condition at low temperature (<500 degreesC). For comparison and long-term stability test, we also deposited TiW (weight ratio 30 : 710) ohmic contacts to p and n-type epilayers of 4H-SiC. The specific contact resistances (p(c)) were found to be as low as p- 5X10(-6), 2x10(-5), 2x10(-5), 3x10(-4), 4x10(-5), and 1X10(-4) Omegacm(2) for TiC contacts to n(+) epilayers, p(+) epilayers, and Al-ion-implanted layers, Ti contacts to p(+) epilayers, and TiW contacts to p(+) and to n(+) epilayers, respectively, by using linear transmission line method (TLM) measurements. During the long-term reliability tests in a vacuum chamber, we found that evaporated Au capping layers helped to keep the contacts from degrading.
Ämnesord och genrebeteckningar
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Ohmic contacts
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4H-silicon carbide
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Long-term reliability
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silicon-carbide
Biuppslag (personer, institutioner, konferenser, titlar ...)
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Zetterling, Carl-MikaelKTH,Mikroelektronik och informationsteknik, IMIT(Swepub:kth)u15o61ns
(författare)
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Östling, MikaelKTH,Mikroelektronik och informationsteknik, IMIT(Swepub:kth)u1u0kle4
(författare)
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Moon, B. M.
(författare)
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KTHMikroelektronik och informationsteknik, IMIT
(creator_code:org_t)
Sammanhörande titlar
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Ingår i:Journal of the Korean Physical Society40:4, s. 572-5760374-48841976-8524
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