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Inclusion engineeri...
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Wang, WeiKTH,Materialvetenskap,Northeast Elect Power Univ, Dept Chem Engn, Jilin 132012, Jilin, Peoples R China.
(författare)
Inclusion engineering in Co-based duplex entropic alloys
- Artikel/kapitelEngelska2021
Förlag, utgivningsår, omfång ...
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Elsevier BV,2021
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printrdacarrier
Nummerbeteckningar
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LIBRIS-ID:oai:DiVA.org:kth-303033
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https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-303033URI
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https://doi.org/10.1016/j.matdes.2021.110097DOI
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Språk:engelska
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Sammanfattning på:engelska
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Ämneskategori:ref swepub-contenttype
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Ämneskategori:art swepub-publicationtype
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QC 20220309
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Co-based duplex entropic alloy is designed very recently to replace pure Co as a major component of the binder phase for cemented carbide cutting tools. This work aims to provide a fundamental study of oxide inclusion characteristics in the duplex fcc + hcp Co-based entropic alloys. It is found that the Co85-xCrxFe7.5Ni7.5 (x = 15, 30 at.%) alloys hold the highest liquidus (T-liq) and solidus (T-sol) temperatures, compare with the Co85-xCrxMn7.5Ni7.5 (x = 15, 30 at.%) and Co77.5-xCrxFe7.5Mn7.5Ni7.5 (x = 15, 30 at.%) alloys. For each grade, the increasing Cr content leads to a decrease of T-sol and T-liq temperatures. It is also noted that there is an approximate 100 degrees C of undercooling exists in each grade during the solidification. The stable oxide inclusion in the Co85-xCrxMn7.5Ni7.5 and Co77.5-xCrxFe7.5Mn7.5Ni7.5 alloys is the MnCr2O4 type, while Cr2O3 is the main stable inclusion in the Co85-xCrxFe7.5Ni7.5 alloy. Furthermore, the size range of the MnCr2O4 particles is larger than that of Cr2O3. The theoretical calculation shows that MnCr2O4 has a higher coagulation coefficient than Cr2O3 does. This is due to the influence of the thermo-physical parameters, i.e. the interfacial energy between the oxide and the alloy and the viscosity of liquid alloy. The theoretical calculation fits well with the experimental findings.
Ämnesord och genrebeteckningar
Biuppslag (personer, institutioner, konferenser, titlar ...)
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Wang, YongKTH,Processer,Hanyang Univ, Dept Mat Sci & Chem Engn, Ansan 15588, South Korea.(Swepub:kth)u1msab4o
(författare)
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Mu, Wangzhong,Dr.1985-KTH,Strukturer,Northeastern Univ, Sch Met, Key Lab Electromagnet Proc Mat, Minist Educ, Shenyang 110819, Peoples R China.(Swepub:kth)u1o72emm
(författare)
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Park, Joo HyunKTH,Processer,Hanyang Univ, Dept Mat Sci & Chem Engn, Ansan 15588, South Korea.(Swepub:kth)u139gpma
(författare)
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Kong, HuiAnhui Univ Technol, Sch Met Engn, Maanshan 243002, Anhui, Peoples R China.
(författare)
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Sukenaga, SoheiTohoku Univ, Inst Multidisciplinary Res Adv Mat, Aoba Ku, 2-1-1 Katahira, Sendai, Miyagi 9808577, Japan.
(författare)
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Shibata, HiroyukiTohoku Univ, Inst Multidisciplinary Res Adv Mat, Aoba Ku, 2-1-1 Katahira, Sendai, Miyagi 9808577, Japan.
(författare)
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Larsson, HenrikKTH,Strukturer,Thermo Calc Software, Råsundav 18, SE-16767 Solna, Sweden.(Swepub:kth)u1z5mmxu
(författare)
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Mao, Huahai,1971-KTH,Strukturer,Thermo Calc Software, Råsundav 18, SE-16767 Solna, Sweden.(Swepub:kth)u1v302dc
(författare)
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KTHMaterialvetenskap
(creator_code:org_t)
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Ingår i:Materials & design: Elsevier BV2100264-12751873-4197
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Wang, Wei
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Wang, Yong
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Mu, Wangzhong, D ...
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Park, Joo Hyun
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Kong, Hui
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Sukenaga, Sohei
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Shibata, Hiroyuk ...
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Larsson, Henrik
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Mao, Huahai, 197 ...
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