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Scalability of Netw...
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Weldezion, Awet YemaneKTH,Elektronik- och datorsystem, ECS
(author)
Scalability of Network-on-Chip Communication Architecture for 3-D Meshes
- Article/chapterEnglish2009
Publisher, publication year, extent ...
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NEW YORK :IEEE,2009
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printrdacarrier
Numbers
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LIBRIS-ID:oai:DiVA.org:kth-30398
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https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-30398URI
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https://doi.org/10.1109/NOCS.2009.5071459DOI
Supplementary language notes
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Language:English
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Summary in:English
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Subject category:ref swepub-contenttype
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Subject category:kon swepub-publicationtype
Notes
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QC 20110301
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Design Constraints imposed by global interconnect delays as well as limitations in integration of disparate technologies make 3-D chip stacks an enticing technology solution for massively integrated electronic systems. The scarcity of vertical interconnects however imposes special constraints on the design of the communication architecture. This article examines the performance and scalability of different communication topologiesfor 3-D Network-on-Chips (NoC) using Through-Silicon-Was (TSV) for inter-die connectivity. Cycle accurate RTL-level simulations are conducted for two communication schemes based on a 7-port switch and a centrally arbitrated vertical bus using different traffic patterns. The scalability of the 3-D NoC is examined under both communication architectures and compared to 2-D NoC structures in terms of throughput and latency in order to quantify the variation of network performance with the number of nodes and derive key design guidelines.
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Added entries (persons, corporate bodies, meetings, titles ...)
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Grange, Matt
(author)
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Pamunuwa, Dinesh
(author)
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Lu, ZhonghaiKTH,Elektronik- och datorsystem, ECS(Swepub:kth)u1wqy6h0
(author)
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Jantsch, AxelKTH,Elektronik- och datorsystem, ECS(Swepub:kth)u18wycaf
(author)
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Weerasekera, Roshan
(author)
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Tenhunen, HannuKTH,Elektronik- och datorsystem, ECS(Swepub:kth)u1wjjaxp
(author)
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KTHElektronik- och datorsystem, ECS
(creator_code:org_t)
Related titles
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In:2009 3RD ACM/IEEE INTERNATIONAL SYMPOSIUM ON NETWORKS-ON-CHIPNEW YORK : IEEE, s. 114-1239781424441426
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