Ultrafast carrier dynamics in highly resistive InP and InGaAs produced by ion implantation

• Heavy ion implantation into InP and In0.53Ga0.47As and rapid thermal annealing has been applied to produce materials with high resistivity, good mobility and ultrashort carrier lifetime, as required for ultrafast optoelectronic applications. Two implantation methods have been analyzed: Fe+ implantation into semi-insulating InP and InGaAs, and P+ implantation into p-doped InP and InGaAs. Both approaches allow production of layers with high sheet resistance, up to 10(6) Omega/square for the P+-implanted compounds. Electron mobility in the high resistivity layers is of the order of 10(2) cm(2)V(-1)s(-1). Carrier lifetimes, measured by the time-resolved photoluminescence and reflectivity, can be tuned from similar to100 femtoseconds to tens of picoseconds by choosing implantation and annealing conditions. Measurements of carrier dynamics have shown that carrier traps act as efficient recombination centers, at least for the case of InP. The dependencies of electrical and ultrafast optical properties on the implantation dose and annealing temperature are determined by the interplay between shallow P and As antisite-related donors, deep Fe-related acceptors and defect complexes.

Ämnesord

NATURVETENSKAP  -- Fysik -- Atom- och molekylfysik och optik (hsv//swe)

NATURAL SCIENCES  -- Physical Sciences -- Atom and Molecular Physics and Optics (hsv//eng)

Nyckelord

InP

InGaAs

ion implantation

ultrafast carrier trapping

time resolved photoluminescence

transient reflectivity

semi-insulating semiconductor

Publikations- och innehållstyp

ref (ämneskategori)

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