LOW TEMPERATURE “CLICK” WAFER BONDING OF OFF-STOICHIOMETRY THIOL-ENE (OSTE) POLYMERS TO SILICON

• We present a low temperature (< 37°C) wafer-scale microfluidic batch packaging process using covalent, dry bonding of offstoichiometry thiol-ene polymers (OSTE), enabling rapid, bio-compatible integration of fluidics on wafer-scale in combination with excellent polymer properties.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Kemiteknik -- Polymerteknologi (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Chemical Engineering -- Polymer Technologies (hsv//eng)

Keyword

Biocompatible

Off-stoichiometry thiol-ene (OSTE)

Packaging

Wafer-scale bonding

Publication and Content Type

ref (subject category)

kon (subject category)