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Search: (WFRF:(Stern A.)) srt2:(2005-2009) > (2009) > Etching of Graphene...

Etching of Graphene Devices with a Helium Ion Beam

Lemme, Max C., 1970- (author)
Harvard University, Department of Physics
Bell, David C. (author)
Williams, James R. (author)
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Stern, Lewis A. (author)
Baugher, Britton W. H. (author)
Jarillo-Herrero, Pablo (author)
Marcus, Charles M. (author)
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 (creator_code:org_t)
2009-09-22
2009
English.
In: ACS Nano. - : American Chemical Society (ACS). - 1936-0851 .- 1936-086X. ; 3:9, s. 2674-2676
  • Journal article (peer-reviewed)
Abstract Subject headings
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  • We report on the etching of graphene devices with a helium ion beam, including in situ electrical measurement during lithography. The etching process can be used to nanostructure and electrically isolate different regions In a graphene device, as demonstrated by etching a channel in a suspended graphene device with etched gaps down to about 10 nm. Graphene devices on silicon dioxide (02) substrates etch with lower He ion doses and are found to have a residual conductivity after etching, which we attribute to contamination by hydrocarbons.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Nanoteknik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Nano-technology (hsv//eng)

Keyword

graphene
transistor
helium ion microscope
etching

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