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Impact of Al-, Ni-,...
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Abermann, S.Institute of Solid State Electronics, Vienna University of Technology
(author)
Impact of Al-, Ni-, TiN-, and Mo-metal gates on MOCVD-grown HfO2 and ZrO2 high-k dielectrics
- Article/chapterEnglish2007
Publisher, publication year, extent ...
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Elsevier BV,2007
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Numbers
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LIBRIS-ID:oai:DiVA.org:kth-50533
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https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-50533URI
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https://doi.org/10.1016/j.microrel.2007.01.002DOI
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https://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-11288URI
Supplementary language notes
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Language:English
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Summary in:English
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Classification
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Subject category:ref swepub-contenttype
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Subject category:art swepub-publicationtype
Notes
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QC 20120228
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In this work we compare the impacts of nickel (Ni), titanium-nitride (TiN), molybdenum (Mo), and aluminium (Al), gates on MOS capacitors incorporating HfO2- or ZrO2-dielectrics. The primary focus lies on interface trapping, oxide charging, and thermodynamical stability during different annealing steps of these gate stacks. Whereas Ni, Mo, and especially TIN are investigated as most promising candidates for future CMOS devices, Al acted as reference gate material to benchmark the parameters. Post-metallization annealing of both, TiN- and Mo-stacks, resulted in very promising electrical characteristics. However, gate stacks annealed at temperatures of 800 degrees C or 950 degrees C show thermodynamic instability and related undesirable high leakage currents.
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Added entries (persons, corporate bodies, meetings, titles ...)
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Efavi, J.
(author)
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Sjöblom, GustafUppsala universitet,Fasta tillståndets elektronik(Swepub:uu)gusjo205
(author)
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Lemme, Max C.,1970-AMO GmbH, AMICA, Aachen, Germany(Swepub:kth)u1m2eozy
(author)
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Olsson, JörgenUppsala universitet,Fasta tillståndets elektronik(Swepub:uu)jorgolss
(author)
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Bertagnolli, E.Institute of Solid State Electronics, Vienna University of Technology
(author)
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Institute of Solid State Electronics, Vienna University of TechnologyFasta tillståndets elektronik
(creator_code:org_t)
Related titles
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In:Microelectronics and reliability: Elsevier BV47:4-5, s. 536-5390026-27141872-941X
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