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Transmission electron microscopy investigation of defects in B-implanted 6H-SiC

Persson, P. O. Å (author)
Wahab, Q. (author)
Hultman, L. (author)
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Nordell, Nils (author)
Industrial Microelectronics Center, Sweden
Schöner, A. (author)
Rottner, K. (author)
Olsson, E. (author)
Linnarsson, Margareta (author)
KTH,Elektronik,Solid State Electronics
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 (creator_code:org_t)
1998-02
1998
English.
In: Silicon carbide, III-nitrides and related materials : ICSCIII-N'97. - : Trans Tech Publications Inc.. - 0878497900 ; , s. 413-416
  • Conference paper (peer-reviewed)
Abstract Subject headings
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  • Silicon carbide is due to its wide bandgap, high saturated electron drift velocity, high electric breakdown field and high thermal conductivity a suitable material for electron devices operating at high temperatures, high powers and high frequencies.[1,2] In order for SIC to reach its full potential in device technology, doping is essential. Usually ion implantation is used for doping since diffusion is difficult in SiC. Boron is a useful material for implantation because of its low atomic weight and greater penetration depth than other accepters, yet very few studies have been conducted on B-implanted 6H-SiC. [3,4] In this investigation we have used transmission electron microscopy (TEM) to study structural defects that are found in B-implanted 6H-SiC layers.

Subject headings

NATURVETENSKAP  -- Fysik -- Den kondenserade materiens fysik (hsv//swe)
NATURAL SCIENCES  -- Physical Sciences -- Condensed Matter Physics (hsv//eng)

Keyword

Boron Implantation
Boron Precipitates
Electron Microscopy
Elemental Mapping
Planar Defects

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