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Physical mapping an...
Physical mapping and performance study of a multi-clock 3-Dimensional Network-on-Chip mesh
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Grange, Matt (author)
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- Weldezion, Awet Yemane (author)
- KTH,Elektronik- och datorsystem, ECS
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Pamunuwa, Dinesh (author)
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Weerasekera, Roshan (author)
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- Lu, Zhonghai (author)
- KTH,Elektronik- och datorsystem, ECS
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- Jantsch, Axel (author)
- KTH,Elektronik- och datorsystem, ECS
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Shippen, D. (author)
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(creator_code:org_t)
- San Francisco : IEEE conference proceedings, 2009
- 2009
- English.
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In: 2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION. - San Francisco : IEEE conference proceedings. - 9781424445110 ; , s. 345-351
- Related links:
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https://urn.kb.se/re...
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https://doi.org/10.1...
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Abstract
Subject headings
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- The physical performance of a 3-Dimensional Network-on-Chip (NoC) mesh architecture employing through silicon vias (TSV) for vertical connectivity is investigated with a cycle-accurate RTL simulator. The physical latency and area impact of TSVs, switches, and the on-chip interconnect is evaluated to extract the maximum signaling speeds through the switches, horizontal and vertical network links. The relatively low parasitics of TSVs compared to the on-chip 2-D interconnect allow for higher signaling speeds between chip layers. The system-level impact on overall network performance as a result of clocking vertical packets at a higher rate through the TSV interconnect is simulated and reported.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Inbäddad systemteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Embedded Systems (hsv//eng)
Keyword
- cycle-accurate RTL simulator;horizontal network link;multiclock 3-dimensional network-on-chip mesh architecture;on-chip interconnect;physical mapping;switches;system-level impact;through silicon vias;vertical network link;integrated circuit interconnections;network analysis;network-on-chip
Publication and Content Type
- ref (subject category)
- kon (subject category)
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