SwePub
Sök i LIBRIS databas

  Extended search

WFRF:(Ma Jun)
 

Search: WFRF:(Ma Jun) > (2005-2009) > A 5Mgate/414mW Netw...

  • Ma, NingKTH,VinnExcellence Center for Intelligence in Paper and Packaging, iPACK,Elektronik- och datorsystem, ECS (author)

A 5Mgate/414mW Networked Media SoC in 0.13um CMOS with 720p Multi-Standard Video Decoding

  • Article/chapterEnglish2009

Publisher, publication year, extent ...

  • IEEE Solid-State Circuits Society,2009
  • printrdacarrier

Numbers

  • LIBRIS-ID:oai:DiVA.org:kth-62206
  • https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-62206URI
  • https://doi.org/10.1109/ASSCC.2009.5357177DOI

Supplementary language notes

  • Language:English
  • Summary in:English

Part of subdatabase

Classification

  • Subject category:ref swepub-contenttype
  • Subject category:kon swepub-publicationtype

Notes

  • QC 20120224
  • A flexible and high performance SoC is developed for networked media applications by integrating two RISC cores, Ethernet network interface and coarse-grained configurable video decoding unit. Real-time 1280x720@25fps MPEG-2/MPEG-4/RealVideo decoding is achieved for on-line video streams. The SoC is fabricated in 0.13um single-poly eight-metal CMOS technology with core size of 6.4mm * 6.4mm. To achieve low power design, flexible power management strategy is implemented for dynamically control of computational capabilities with various workloads. The maximum power consumption is 414mW at 1.2V supply voltage with the corresponding system frequency of 216MHz, when real-time HD (1280x720@25fps) video streams are decoded. When the SoC decodes real-time CIF (352x288@25fps) video streams, it requires 27MHz system frequency and consumes 95mW.

Subject headings and genre

Added entries (persons, corporate bodies, meetings, titles ...)

  • Pang, ZhiboKTH,VinnExcellence Center for Intelligence in Paper and Packaging, iPACK,Elektronik- och datorsystem, ECS(Swepub:kth)u1t26ns5 (author)
  • Chen, JunKTH,VinnExcellence Center for Intelligence in Paper and Packaging, iPACK,Elektronik- och datorsystem, ECS(Swepub:kth)u1mrq273 (author)
  • Tenhunen, HannuKTH,VinnExcellence Center for Intelligence in Paper and Packaging, iPACK,Elektronik- och datorsystem, ECS(Swepub:kth)u1wjjaxp (author)
  • Zheng, LirongKTH,VinnExcellence Center for Intelligence in Paper and Packaging, iPACK,Elektronik- och datorsystem, ECS(Swepub:kth)u1q4gmpy (author)
  • KTHVinnExcellence Center for Intelligence in Paper and Packaging, iPACK (creator_code:org_t)

Related titles

  • In:2009 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE (A-SSCC): IEEE Solid-State Circuits Society, s. 385-3889781424444342

Internet link

Find in a library

To the university's database

Find more in SwePub

By the author/editor
Ma, Ning
Pang, Zhibo
Chen, Jun
Tenhunen, Hannu
Zheng, Lirong
About the subject
ENGINEERING AND TECHNOLOGY
ENGINEERING AND ...
and Electrical Engin ...
Articles in the publication
2009 IEEE ASIAN ...
By the university
Royal Institute of Technology

Search outside SwePub

Kungliga biblioteket hanterar dina personuppgifter i enlighet med EU:s dataskyddsförordning (2018), GDPR. Läs mer om hur det funkar här.
Så här hanterar KB dina uppgifter vid användning av denna tjänst.

 
pil uppåt Close

Copy and save the link in order to return to this view